Microstructural Device Manufacture TRIZ Cases

Localized HSQ dielectric supports planarize and connect uneven microstructures with low thermal budget and better mechanical robustness.

Residual stress keeps this piezoelectric MEMS valve normally open, while voltage bends the cantilever to close tightly and prevent leakage.

Residual compressive stress keeps the MEMS valve open without power, while piezoelectric actuation closes it tightly to cut leakage in compact systems.

A spherical shell and test board simulate realistic MEMS drop impacts while limiting external silicon damage and exposing internal defects.

Variable laser pulse spacing controls etching radius and sidewall scalloping in glass comb fingers, enabling narrow gaps and uniform actuation.

Low-concentration HF vapor selectively etches sacrificial layers, eliminating stiction caused by cohesive forces in wet solutions.

Segmented oxide etching reduces undercut under the MEMS anchor, preserving strength while maintaining design flexibility.

A donor substrate transfers a surface layer onto a carrier with cavities using temporary pillars for support during molecular adhesion.

Segmented MEMS anchors mitigate shear stress from external forces by using flexible elements for electrical connections, preserving robust mechanical anchoring.

Ultrashort pulse laser structures glass elements to eliminate mechanical stresses and surface irregularities found in conventional machining.

Spacer structures fill trench voids to support metal films, preventing contact line breaks that disrupt signal transmission in piezoelectric MEMS devices.

Reactive additive polymers anchor block copolymers to substrates, reducing coat-and-bake steps while maintaining nanodomain alignment.