Microstructural Device Manufacture TRIZ Cases
- Dielectric Planarization Support for Low-Temperature Microstructure Linking
Localized HSQ dielectric supports planarize and connect uneven microstructures with low thermal budget and better mechanical robustness.
- Piezoelectric MEMS Valve Cantilever for Tight Microfluidic Sealing
Residual stress keeps this piezoelectric MEMS valve normally open, while voltage bends the cantilever to close tightly and prevent leakage.
- Normally-Open Piezoelectric MEMS Valve Using Residual-Stress Cantilever
Residual compressive stress keeps the MEMS valve open without power, while piezoelectric actuation closes it tightly to cut leakage in compact systems.
- Spherical MEMS Drop Test Body for Controlled Impact Detection
A spherical shell and test board simulate realistic MEMS drop impacts while limiting external silicon damage and exposing internal defects.
- Glass MEMS Comb Structure With Variable Etching Radius Control
Variable laser pulse spacing controls etching radius and sidewall scalloping in glass comb fingers, enabling narrow gaps and uniform actuation.