Floating center electrodes create a band gap in a Lamb wave filter, sharpening band-edge rejection without adding signal delay.
SAW resonators on both sides of one substrate enable multi-band RF filtering in a single chip, cutting package size and part count.
A dual-sided SAW filter chip uses through electrodes and shared packaging to support multiple frequency bands with fewer parts and better yield.
Shared attenuation in a multi-band filter circuit eases single-band rejection demands, cutting filter complexity while improving band isolation.
Alternating-polarity piezoelectric stacks using ALD and sputtering raise BAW resonant frequency while preserving stability and power handling.
Stacked piezoelectric layers with ALD polarization inversion raise BAW resonant frequency while preserving stability and power handling.
Stacked oppositely polarized piezoelectric layers formed by ALD and sputtering help BAW resonators reach high frequency with better stability and power handling.
A grounded conductor beneath low-permittivity insulation suppresses wiring capacitive coupling and preserves insertion loss in compact acoustic wave filters.
An added resonator before the SAW ladder filter diverts heat and electrical load, protecting the initial resonator and stabilizing filter characteristics.
Coplanar IDT electrodes and locally varied piezoelectric thickness simplify multi-band filter fabrication while preserving electrode uniformity.
Parallel BAW or SAW band-pass filters create a combined passband that widens bandwidth while preserving steep roll-off and filtering quality.
Frequency-tuned reflector regions return signals to the correct filter, reducing energy dissipation and insertion loss at common outputs.
A 3D inclined signal-line crossover suppresses leakage between shared filter parts, improving insertion loss and VSWR.