Dual-Sided SAW Filter Packaging for Multi-Band Chip Miniaturization
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Solution Overview
Problem
There is a demand for miniaturized communication devices and filters that can operate across multiple frequency bands, with existing technologies facing limitations in chip size reduction and product yield when using stacked or bonded device wafers of different sizes.
Innovation Solution
A surface acoustic wave (SAW) filter design that incorporates a single chip substrate with SAW resonators on both front and back surfaces, forming separate radio frequency filters for different frequency bands, utilizing through electrodes and cavity frames to support and connect the resonators, allowing for a common package that reduces the number of parts and downsizes the device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple frequency band filters are implemented using separate stacked or bonded device wafers, then each filter can be optimized for its specific frequency band, but the overall device size increases and product yield decreases
Solution Approach 1:
The patent combines multiple frequency band filters (first and second radio frequency filters) onto a single chip substrate, integrating what would traditionally require separate stacked or bonded wafers. This merging approach reduces the overall device area while maintaining multi-frequency band operation capability through shared common electrodes and integrated resonator structures
Solution Approach 2:
The single chip substrate serves multiple functions by hosting both the first and second radio frequency filters that operate in different frequency bands. The common electrodes and shared resonator structures enable the device to handle multiple frequency bands simultaneously, achieving multi-functionality without requiring separate dedicated wafers for each band
2Adaptability or versatility
If multiple frequency band filters are implemented using separate stacked or bonded device wafers, then each filter can be optimized for its specific frequency band, but the number of parts increases and manufacturing complexity increases
Solution Approach 1:
The patent merges multiple filter structures into a single integrated device, reducing the number of separate parts that would result from using stacked or bonded wafers. The first and second radio frequency filters share common electrodes and resonator structures, eliminating the need for separate components and simplifying the overall device architecture
Solution Approach 2:
While integrating multiple filters, the patent segments the chip substrate into distinct first and second piezoelectric layer regions, each optimized for specific frequency band operation. This segmentation allows independent optimization of each filter section while maintaining overall integration, reducing manufacturing complexity compared to handling multiple separate wafers
3Adaptability or versatility
If multiple frequency band filters are implemented using separate stacked or bonded device wafers, then each filter can be optimized for its specific frequency band, but manufacturing precision requirements increase and product yield decreases
Solution Approach 1:
By merging both frequency band filters onto a single chip substrate from the outset, the patent eliminates the need for subsequent stacking or bonding processes that would require high alignment precision. The integrated structure is manufactured as a unified device, reducing manufacturing precision requirements and improving product yield compared to multi-wafer approaches
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The SAW filter achieves reduced device size and improved product yield by integrating multiple frequency bands into a single chip package, minimizing component count and enabling efficient signal filtering across different frequency bands.
Implementation Method 1
The first surface acoustic wave filter structure includes a first piezoelectric layer, a plurality of surface acoustic wave resonators formed on a top surface of the first piezoelectric layer
Implementation Method 2
a plurality of surface acoustic wave resonators formed on a top surface of the first piezoelectric layer
Data Source
AI summary
A method of manufacturing a packaged surface acoustic wave filter chip is disclosed. The method can include providing a structure having first interdigital transducer electrodes formed with a first piezoelectric layer, second interdigital transducer electrodes formed with a second piezoelectric layer, and a substrate between the first and second piezoelectric layers. The method can include forming a plurality of through electrodes extending at least partially through a thickness of the structure such that a first set of through electrodes of the plurality of through electrodes are electrically connected to the first interdigital transducer electrodes and a second set of through electrodes of the plurality of through electrodes are electrically isolated from the first interdigital transducer electrodes.