See how modified conjugated diene rubber with hydrogen-bonding functional groups bonds fibers t
See how an epoxy-amide-latex adhesive replaces resorcin and formalin to bond organic fiber cord
See how esterification and grafting transform cellulose into hydrophobic powder for aqueous tex
A thermally curable adhesive tape protects bumped semiconductor wafers through heat processing, then peels cleanly without residue.
Specific tape-area and fluoroethylene carbonate ratios limit tape warping at high temperature, reducing battery short-circuit risk.