Curable Protective Tape for High-Temperature Wafer Bump Protection
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Solution Overview
Problem
Existing protective tapes for semiconductor wafers fail to withstand high temperatures, adhere to irregular surfaces with copper pillar bumps, and are difficult to remove without leaving residue, complicating semiconductor device fabrication processes.
Innovation Solution
A protective tape comprising a support layer and a curable adhesive layer with a rubber elastomer and thermal curing agent, designed to withstand high temperatures, conform to surface irregularities, and be easily removable without residue, featuring a curable adhesive layer that softens and cures at specific temperatures to facilitate easy peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional adhesive tapes are used for protecting semiconductor wafers during high-temperature processes, then the tapes can be easily applied and removed at room temperature, but they fail to withstand high temperatures and leave residue on the wafer surface
Solution Approach 1:
The adhesive composition is designed to undergo parameter changes with temperature - remaining soft and removable at room temperature for easy application and removal, but transitioning to a stable, residue-free state at high temperatures through controlled curing mechanisms
Solution Approach 2:
The adhesive layer combines multiple materials including rubber elastomers (for flexibility and temperature resistance), curable resins (for thermal stability), and specific additives that work together to achieve both high-temperature withstand capability and clean removal properties
2Temperature
If the adhesive is made highly crosslinked to resist high temperature degradation, then the adhesive can withstand high temperatures, but it becomes difficult to remove cleanly from the device surface
Solution Approach 1:
The adhesive system is designed with dynamic properties that change with temperature - at room temperature it remains soft and easily removable, while at high temperatures it develops sufficient crosslinking to resist degradation, creating a temperature-dependent behavior that resolves the contradiction
Solution Approach 2:
The adhesive is applied in an uncured or partially cured state at room temperature for easy application and initial bonding, then undergoes controlled curing during or after the high-temperature process to achieve thermal resistance while maintaining removal capability
3Ease of operation
If the adhesive is designed to be easily removable at room temperature, then the tape can be cleanly removed without residue, but it fails to adhere properly to irregular surfaces with copper pillar bumps
Solution Approach 1:
The adhesive's physical and chemical parameters are designed to change with temperature and time - initially soft and flowable at room temperature to conform to irregular surfaces, then developing controlled crosslinking to maintain adhesion strength while remaining removable
4Temperature
If multiple tapes or severe cleaning procedures are used to achieve heat resistance and bump absorption, then the adhesive can withstand high temperatures and cover surface irregularities, but the process complexity and time increase
Solution Approach 1:
The single adhesive composition is designed to perform multiple functions simultaneously - providing heat resistance through thermal stability, absorbing surface irregularities through flow and conformability, and enabling clean removal through controlled curing characteristics, eliminating the need for multiple tapes or severe cleaning procedures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The tape effectively protects semiconductor wafers during high-temperature processes, adheres to complex surfaces, and can be cleanly removed, minimizing residue, thereby simplifying fabrication and ensuring process integrity.
Implementation Method 1
a curable adhesive layer that softens and cures at specific temperatures to facilitate easy peeling
Data Source
AI summary
An article includes a substrate having a circuit forming surface and a non-circuit forming surface opposite the circuit forming surface. The article further includes a protective tape borne on the circuit forming surface. The protective tape includes a support layer and a curable adhesive layer borne on a major surface of the support layer. The curable adhesive layer includes a rubber elastomer and a thermal curing agent.