Photosensitive Material Processing TRIZ Cases
- Lithography Resist Swelling Reduction via Cross-Linking
Cross-linking unexposed resist portions increases molecular weight, suppressing developer-induced swelling that degrades line edge roughness.
- Positive Photosensitive Resin Composition for Low Warpage and High Resolution
A positive-type photosensitive resin composition uses alkali-soluble polyimide with epoxy groups to form cured films.
- Photosensitive Resin Composition for Printed Wiring Boards
A photosensitive resin composition forms resist patterns with excellent cross-sectional shape and adhesion.
- Photoimageable Dry Film Adhesion for Fluidic Ejection Heads
Silane oligomer additives in photoimageable dry films prevent enhancer loss during drying, securing substrate adhesion.
- Resist Composition for Organic Solvent Development
A resist composition with lactone polymer units and a photoacid generator enhances dissolution contrast during organic solvent development.
- Resist Composition for Thick Film Adhesion and Solubility
A resist composition uses acid-labile groups to form thick films with precise dimensions.
- Photosensitive Resin Composition Suppressing White Turbidity
A photosensitive resin composition combines alkali-soluble and acryl resins to enhance mechanical properties.