Positive Photosensitive Resin Composition for Low Warpage and High Resolution
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Solution Overview
Problem
Existing positive-type photosensitive resin compositions face challenges such as large warpage, pattern embedment by reflow, and poor resolution during low-temperature curing, particularly in semiconductor device applications where high-resolution and low warpage are critical.
Innovation Solution
A positive-type photosensitive resin composition comprising an alkali-soluble polyimide with a diamine residue or carboxylic acid residue having a polyalkylene oxide group, combined with a compound having two or more epoxy groups and a photo acid generator, optimized to achieve low warpage and high resolution during curing at temperatures of 200°C or lower.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a polyimide precursor or polybenzoxazole precursor is thermally cyclodehydrated to obtain a thin film with excellent heat resistance and mechanical properties, then heat resistance and mechanical properties are improved, but a heating treatment at a high temperature of about 350°C is needed
Solution Approach 1:
The invention introduces polyalkylene oxide groups into the diamine or carboxylic acid residue of the polyimide structure. These groups enable low-temperature curing by facilitating the cyclodehydration reaction at 200°C or lower, while maintaining the heat resistance and mechanical properties of the final cured film
Solution Approach 2:
The invention creates a composite structure by incorporating polyalkylene oxide side chains into the polyimide backbone. This composite approach allows the material to cure at low temperatures while preserving the high heat resistance and mechanical strength characteristics of polyimide materials
2Temperature
If existing positive-type photosensitive resin compositions are used for low-temperature curing, then curing temperature is reduced, but large warpage occurs
Solution Approach 1:
The polyalkylene oxide groups modify the curing behavior by enabling a controlled low-temperature reaction pathway that proceeds uniformly, reducing differential shrinkage and stress that cause warpage. The invention achieves this by carefully selecting the polyalkylene oxide structure and its incorporation into the polyimide framework
3Temperature
If existing positive-type photosensitive resin compositions are used, then low-temperature curing is achieved, but pattern embedment by reflow occurs
Solution Approach 1:
The invention optimizes the polyalkylene oxide group structure and content to control the reflow behavior during curing. By adjusting these parameters, the cured film maintains sufficient rigidity at curing temperatures to prevent pattern embedment, while still enabling low-temperature processing
Solution Approach 2:
The polyalkylene oxide groups are strategically incorporated into specific positions within the polyimide structure to locally enhance rigidity where needed to prevent pattern collapse, while maintaining overall low-temperature curability of the material
4Temperature
If existing positive-type photosensitive resin compositions are used, then low-temperature curing is achieved, but poor resolution is obtained
Solution Approach 1:
The invention carefully controls the molecular weight, polyalkylene oxide group content, and structure to optimize the balance between low-temperature curability and resolution. The specific parameter ranges disclosed ensure that the material cures completely at low temperatures while maintaining the sharpness of pattern edges
Data Source
AI summary
Disclosed is a positive-type photosensitive resin composition including (a) an alkali-soluble polyimide, (b) a compound having two or more epoxy groups in a molecule, and (c) a photo acid generator, wherein the content of the compound having two or more epoxy groups in a molecule (b) is within a range of 5 to 50 parts by weight based on 100 parts by weight of the alkali-soluble polyimide (a). The present invention provides a positive-type photosensitive resin composition capable of obtaining a high-resolution cured film which exhibits low warpage and also does not cause pattern embedment by reflow during a heating treatment at a low temperature of 200°C or lower.