Hydrogen-generating silane polymer foam replaces isocyanate and fluoro-compound foaming while maintaining adhesion, sealing, and uniform cells.
A partially fluorinated PFPE gel composition improves plasticizer compatibility to stop bleed-out under heat while retaining curing and sealing reliability.
A combined amidine and titanium catalyst speeds curing of bifunctional dialkoxysilyl polymer compositions without using tin.
A combined amidine and titanium catalyst with a specific silane condensate speeds curing while avoiding toxic organotin compounds.
A two-component silane-modified polymer foam seals large joints in situ using acid-water CO2 foaming instead of isocyanates.
Reactive silyl groups crosslink blended polyoxyalkylene and (meth)acrylic ester polymers, balancing cured-product strength and elongation.
A polymer composition with reactive silyl groups and lignin derivatives enables adjustable mechanical properties through cross-linking.
A PEEK-PEDEK copolymer composition bonds directly to metal substrates.
High silyl modified polymer adhesive uses structured carbon black to boost tensile strength and elongation.
Alcohol mediates crosslinking in silane-modified resin, extending pot life while maintaining adhesive strength.
Replacing volatile polybutadiene binders with natural oils eliminates odor and flammability risks while maintaining strength.
Incorporating hydrophilic additives into silicone sealants resolves the contradiction between water resistance and paintability by enabling aqueous wetting.
Blocked amino silanes in the adhesive enable rapid curing at moderate temperatures, eliminating ester hydrolysis and ensuring roller stability.
Alkali metal salt modifies hydroxyl-terminated polyoxyalkylene polymers with epoxy compounds to introduce reactive silicon groups at chain ends.
Segmented silyl polymer terminals prevent premature curing, resolving the trade-off between crosslink density and initial adhesion in contact adhesives.
Incorporating epoxidized methoxyphenol monomers into the polyether backbone to form crosslinked siloxane networks.
Dual organic peroxides crosslink the adhesive matrix to trap conductive particles at fine bump pitches, reducing short-circuit probability.