Two laser beams with different energy and divergence sinter then deflash PCB defects, keeping repaired traces flush to avoid short circuits.
Two lasers split PCB repair into sintering and deflashing, keeping repaired traces flush and avoiding shorts to adjacent circuits.
Dynamic laser spot size, fluence, and waist control speeds printed circuit defect repair while preserving precision on fine features.
Vacuum pressure flattens bowed circuit board assemblies during dispensing, improving thermal interface material placement and reducing manufacturing errors.
A microfluidic device dispenses etchant to remove circuit defects with precise flow control.
Barrier layer covers sensitive zones while exposing electrodes, preventing wet stripper corrosion.