Dual-Laser PCB Repair for Sintering and Precise Deflashing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing laser repair devices for circuit boards are prone to causing short circuits due to the high energy concentration and large beam divergence of laser beams, which can lead to adjacent circuits being contacted during repairs.
Innovation Solution
A dual laser repair device with two laser members emitting different energies and angles of divergence is used to sinter and deflash circuits, ensuring the repaired circuit sides are flush with conducting portions to prevent short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single laser beam is used to repair defective circuits, then the repair process is simple, but the high energy concentration and large beam divergence cause the repaired circuit to contact adjacent circuits, forming short circuits
Solution Approach 1:
The single laser beam is segmented into two separate laser beams with different characteristics. The first laser beam (first laser member) has higher energy concentration for effective sintering, while the second laser beam (second laser member) has lower energy and smaller divergence angle for precise deflashing. This segmentation allows each laser to perform its specific function without causing harmful effects to adjacent circuits.
Solution Approach 2:
Different regions of the repair process are assigned different laser characteristics. The first laser member provides high energy concentration localized at the defective portion for sintering, while the second laser member provides controlled, lower energy for deflashing the sintered portion. This local quality differentiation ensures that each stage of the repair process receives the appropriate energy level to prevent short circuits.
2Manufacturing precision
If high energy laser beam is used to sinter the defective portion, then the sintering effect is effective, but the large beam divergence causes the repaired circuit to contact adjacent circuits
Solution Approach 1:
The sintering and deflashing functions are segmented into two separate laser members. The first laser member is dedicated to sintering with high energy concentration, while the second laser member handles deflashing with controlled beam divergence. This segmentation eliminates the harmful effect of beam divergence causing contact while preserving the effective sintering quality.
Solution Approach 2:
The potential harmful effect of beam divergence is converted into a benefit by using it selectively. The first laser member utilizes higher divergence for effective sintering coverage, while the second laser member uses lower divergence for precise deflashing. The system transforms what could be a harmful factor into a controllable parameter that serves different functional needs.
3Device complexity
If a single laser member performs both sintering and deflashing, then the device is simple, but it cannot control energy and beam divergence separately for each function
Solution Approach 1:
The single laser member is segmented into two independent laser members, each with independently controllable energy and beam divergence parameters. This segmentation enables the first laser member to optimize for sintering with higher energy and the second laser member to optimize for deflashing with lower energy and controlled divergence, providing the necessary adaptability for each function.
Solution Approach 2:
The system introduces dynamic control capabilities by allowing independent adjustment of energy and beam divergence parameters for each laser member. This dynamic flexibility enables the device to adapt to different repair conditions and optimize performance for both sintering and deflashing operations, transforming a static single-laser system into a dynamically controllable dual-laser system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The dual laser repair device effectively transforms defective circuits into sintered portions while maintaining electrical conduction and preventing contact with adjacent circuits, thereby avoiding short circuits.
Implementation Method 1
the first laser member is used to transform the defective portion of the circuit into a sintered portion
Implementation Method 2
the first laser member is used to transform the defective portion of the circuit into a sintered portion
Implementation Method 3
the second laser member is used to carry out deflashing of the sintered portion
Implementation Method 4
the second laser member is used to carry out deflashing of the sintered portion
Data Source
AI summary
An operating method of a dual laser repair device is used to repair a circuit board with circuit defects, wherein a defective circuit has two conducting portions and a defective portion located between the two conducting portions. The operating method includes: using a first laser member of a dual laser repair module to emit a laser beam toward the circuit board, thereby transforming the defective portion of the defective circuit into a sintered portion; and directing a laser beam from the second laser member of the dual laser repair module with an energy and/or with an angle of divergence different from that of the laser beam emitted by the first laser member toward the sintered portion to carry out deflashing thereof, causing sintered sides of the sintered portion to be flush with two conducting sides of the two conducting portions.