Semiconductor/Solid-State Device Testing/Measurement TRIZ Cases
- Trench-Based Fabrication of MRAM Thin-Film Magnetic Components
A trench layer defines magnetic tunnel junction geometry to deposit thin-film components with precise dimensions.
- Semiconductor-on-Insulator Dielectric Layer Hydrogen Evacuation
Heat treatment evacuates hydrogen atoms from semiconductor-on-insulator dielectric layers to increase charge to breakdown.
- Semiconductor Metal Trace Stability Under Dielectric Layers
Embedding a metal trace under multiple dielectric layers resolves cracking susceptibility caused by inadequate structural support in semiconductor connections.
- Curvature Measurement Using Polarized Laser Beams and PSDs
A curvature measurement apparatus separates laser beams by polarization to detect substrate warpage using one-dimensional position sensitive detectors.