A flared MOV electrode profile increases edge spacing to lower electric field concentration, reduce overheating, and improve surge reliability.
A conductive cover layer and slit structure improve resistor heat dissipation, stabilize resistance, and relieve thermal stress.
A conductive covering layer improves heat dissipation in current-sense resistors, stabilizing resistance and helping prevent short circuits.
Novel PCB resistive patch shapes balance parasitic capacitance and inductance, keeping impedance close to DC values up to 50 GHz.
Palladium silver front electrodes prevent silver diffusion into resistive elements during sintering.