Thermoelectric Device Details TRIZ Cases
- Hybrid Rack Cooling with TEC Backup for Coolant Flow Failure
A cold plate plus TEC and finned heat sink keeps rack IT components within safe temperatures when liquid coolant flow stops.
- Thermoelectric Module Sealing with Offset Solder Fillets
Offset solder edges form fillet shapes that prevent cavity formation from flux extrusion, ensuring robust module sealing.
- Thermoelectric Module Silver Bonding Diffusion Prevention
Silver bonding layer with nickel and aluminum electrodes prevents component diffusion at 250C, maintaining electrical resistance stability.
- Thermoelectric Module Bonding with Stress Relaxation and Diffusion Barriers
Composite bonding layers relax thermal stress and block component diffusion, maintaining high temperature stability in filled Skutterudite thermoelectric modules.
- Thermoelectric Electrode Material Preventing Cracking Under High Temperature
Gold or nickel electrodes prevent alloy phase formation with bismuth-tellurium semiconductors during high-temperature annealing, maintaining low resistance.
- Half-Heusler Thermoelectric Materials for Exhaust Heat Recovery
Half-Heusler compounds convert exhaust heat into electricity with a figure of merit exceeding 1.0, eliminating cooling devices.