Thermoelectric Module Silver Bonding Diffusion Prevention
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Solution Overview
Problem
Thermoelectric conversion modules using solder lack sufficient heat resistance and face issues with component diffusion at high temperatures, particularly with the diffusion prevention layer described in existing technologies.
Innovation Solution
A thermoelectric conversion module is designed with a silver-based bonding layer, incorporating a nickel and aluminum diffusion prevention structure for the electrodes, which includes a nickel layer and an aluminum layer to prevent component diffusion and enhance heat resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If solder is used for bonding the thermoelectric element to the substrate, then ease of manufacture is improved, but heat resistance deteriorates at temperatures of 250°C or higher
Solution Approach 1:
The bonding material is changed from solder to a silver-based material, fundamentally altering the material parameter to achieve both ease of manufacture and high heat resistance. The silver-based bonding layer can withstand temperatures of 250°C or higher while maintaining bonding effectiveness, resolving the contradiction between ease of manufacture and heat resistance.
Solution Approach 2:
The electrode structure uses a composite material approach with multiple layers including a silver-based bonding layer, nickel layer, and aluminum layer. This composite structure combines the advantages of different materials: silver provides high heat resistance and bonding capability, nickel provides diffusion prevention, and aluminum provides additional protective functions, collectively achieving both ease of manufacture and high heat resistance.
2Stability of the object's composition
If a diffusion prevention layer made of molybdenum, tungsten, niobium, or tantalum is used, then component diffusion is prevented, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The diffusion prevention layer material is changed from complex materials like molybdenum, tungsten, niobium, or tantalum to a silver-based material with nickel and aluminum layers. This parameter change simplifies the material selection and manufacturing process while maintaining effective diffusion prevention at high temperatures.
Solution Approach 2:
The diffusion prevention function is achieved through a composite layered structure of silver-based material, nickel layer, and aluminum layer. This composite approach distributes the functional requirements across multiple layers, with each layer contributing to diffusion prevention, thereby reducing device complexity compared to using single complex materials.
3Stability of the object's composition
If existing diffusion prevention layers are used at high temperatures, then component diffusion is partially prevented, but sufficient heat resistance cannot be achieved
Solution Approach 1:
The bonding and diffusion prevention system is changed from solder-based or conventional diffusion prevention layers to a silver-based material system. This parameter change enables the system to maintain both diffusion prevention capability and sufficient heat resistance at temperatures of 250°C or higher, simultaneously improving both contradictory aspects.
Solution Approach 2:
The silver-based bonding layer is combined with nickel and aluminum layers to create a composite structure that provides both diffusion prevention and high heat resistance. The synergistic effect of these materials allows the system to withstand high temperatures while effectively preventing component diffusion, resolving the contradiction between diffusion prevention and heat resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The module achieves high heat resistance and maintains thermoelectric conversion performance by preventing diffusion of solder components into the thermoelectric elements, ensuring stable electrical resistance and efficiency at temperatures of 250°C or higher.
Implementation Method 1
the first electrode includes a first nickel layer and an aluminum layer that is disposed between the first nickel layer and the N-type element
Implementation Method 2
The first electrode includes a first nickel layer and an aluminum layer that is disposed between the first nickel layer and the N-type element
Implementation Method 3
The bonding layer includes silver and is disposed between the substrate and the plurality of thermoelectric elements
Implementation Method 4
a thermoelectric conversion module utilizing a thermoelectric element
Data Source
AI summary
A thermoelectric conversion module includes: a substrate; a plurality of thermoelectric elements including an N-type element and a P-type element; a bonding layer including silver and disposed between the substrate and the plurality of thermoelectric elements; a first electrode that connects the N-type element with the bonding layer, the first electrode including a first nickel layer and an aluminum layer that is disposed between the first nickel layer and the N-type element; and a second electrode that connects the P-type element with the bonding layer, the second electrode including a second nickel layer.