A movable compensating grip changes the sheet winding path to prevent humps and noise when coiling thicker metal sheets at high speed.
An articulated robot with a directly mounted gripper holds the workpiece during rolling to enable precise longitudinal movement.
A tilting frame and guide frame transport rolling ingots between furnaces.
Segmented movable centering members automatically adjust substrate position to reduce edge exclusion areas and improve deposition uniformity.
Adjustable eccentric pivot arms vary spacing to reduce impact noise during plate turnover.
Segmented rotary flipping mechanisms resolve the contradiction between high automation efficiency and system complexity in semiconductor backend handling.
Dynamic clamping accommodates longitudinal shrinkage and deflection, preventing surface damage while maintaining rectilinear alignment.