2.5D Interposer Signal Integrity Analysis
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor package design methods fail to effectively analyze and address the influence of stack structures in 2.5D interposers and vertically stacked dies, leading to difficulties in detecting and optimizing signal and power integrity.
Innovation Solution
A method and system for analyzing signal and power integrity in semiconductor packages with 2.5D interposers and vertically stacked dies, involving layout generation, electrical property extraction, and modification based on analysis results to improve package design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If existing planar die design process flow is used, then design simplicity is maintained, but signal integrity and power integrity analysis capability for stack structures is insufficient
Solution Approach 1:
The design process is segmented into distinct modules: layout generation module creates initial layouts, extraction module obtains electrical properties, analysis module evaluates signal and power integrity, and modification module adjusts layouts. This segmentation allows each module to specialize in specific tasks, improving analysis capability while maintaining manageable process complexity through clear module interfaces.
Solution Approach 2:
An intermediary design system is introduced that acts as a bridge between traditional planar design tools and stack structure requirements. The system includes dedicated extraction and analysis modules that translate complex stack structure electrical properties into analyzable formats, enabling existing design flows to handle 2.5D and 3D stacked architectures without complete process redesign.
2Reliability
If stack structure design is not analyzed, then design time is reduced, but signal integrity and power integrity are compromised
Solution Approach 1:
The extraction module performs preliminary extraction of electrical properties from stack structures before full signal integrity analysis. By pre-processing and organizing electrical property data in advance, the system prepares analysis inputs that enable faster, more accurate signal and power integrity evaluation, reducing overall design time while improving reliability.
Solution Approach 2:
The analysis module provides feedback on signal integrity and power integrity issues to the modification module, which adjusts the layout accordingly. This iterative feedback loop enables continuous improvement of signal and power integrity without requiring complete redesign cycles, optimizing the balance between reliability and design time.
3Manufacturing precision
If layout modification is performed based on comprehensive analysis, then package performance is improved, but manufacturing complexity increases
Solution Approach 1:
The modification module applies localized adjustments to specific regions of the layout based on targeted signal integrity and power integrity issues identified in the analysis. Rather than redesigning entire packages, only affected areas are modified with precise parameter adjustments, maintaining high manufacturing precision while minimizing overall manufacturing complexity.
Data Source
AI summary
A design method for a semiconductor package including a first chip, a second chip, a 2.5 dimensional (2.5D) interposer, a package substrate, and a board includes generating a layout including the 2.5D interposer on the package substrate and the first and second chips individually arranged on the 2.5D interposer, based on design information; analyzing signal integrity and power integrity between the first and second chips from the layout; analyzing signal integrity or power integrity between the first chip and at least one third chip on the board from the layout; and determining whether to modify the layout based on the analysis results.