2D Material Stacked Structure With Hole Anchors for Stronger Adhesion
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Solution Overview
Problem
The adhesion between two-dimensional materials and semiconductor substrates is insufficient due to weak van der Waals forces, leading to instability in semiconductor devices during processing.
Innovation Solution
A stacked structure is created with a two-dimensional material layer having a coverage of 0.6 to 0.99 on a first material layer, featuring holes that expose the first material layer, allowing a second material layer to couple with the first through these holes, thereby enhancing adhesion between layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a two-dimensional material layer is directly grown on a semiconductor substrate, then the manufacturing process is simplified, but the adhesion between the substrate and the two-dimensional material is insufficient
Solution Approach 1:
A first material layer is introduced as an intermediary between the semiconductor substrate and the two-dimensional material layer. This intermediate layer provides anchoring structures that significantly enhance adhesion strength while maintaining the simplicity of direct growth for the two-dimensional material.
Solution Approach 2:
The interface between the substrate and two-dimensional material is segmented into multiple components: the semiconductor substrate, the first material layer with anchoring structures, and the two-dimensional material layer. This segmentation allows each layer to perform its specific function optimally, with the first material layer dedicated to providing mechanical anchoring.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the overall adhesion and stability of the stacked structure, enabling it to withstand stress during semiconductor processes and function effectively as a barrier between layers.
Implementation Method 1
When directly growing the two-dimensional material on the semiconductor substrate, only a weak van der Waals force acts between the semiconductor substrate and the two-dimensional material
Data Source
AI summary
A stacked structure may include a first material layer, a two-dimensional material layer on the first material layer, and a second material layer on the two-dimensional material layer. The two-dimensional material layer may include a plurality of holes that each expose a portion of the first material layer. The second material layer may be coupled to the first material layer through the plurality of holes.