Electrolyte-Enabled 2K Adhesive Composition for Electrical Debonding
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Solution Overview
Problem
Existing adhesive compositions are difficult to disassemble without damaging the substrates, and existing debondable adhesive technologies are either complex or require harsh conditions that can damage the substrates.
Innovation Solution
A two-part curable adhesive composition comprising epoxy resin, an electrolyte, a solubilizer, a curing agent, and optionally a filler, which can be debonded by applying an electrical potential across the cured adhesive.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive bonds are used to join substrates, then bonding strength and joint sealing are improved, but disassembly becomes difficult and substrate damage occurs
Solution Approach 1:
The adhesive composition changes its properties through electrochemical reactions when electrical potential is applied. The electrolyte enables ionic conductivity that supports faradaic reactions at the bond interface, transforming the adhesive from a strong bonding state to a debonded state through controlled chemical changes driven by electrical parameters
Solution Approach 2:
The patent replaces mechanical disassembly methods (sand blasting, wire brushing) and chemical debonding methods with an electrical field-based debonding mechanism. An electrical potential applied across the bonded substrates triggers electrochemical reactions at the adhesive-substrate interface, enabling non-contact, controlled debonding without mechanical or chemical damage to substrates
2Ease of operation
If chemical or high temperature methods are used to debond adhesive, then debonding effectiveness is improved, but substrate damage and process complexity increase
Solution Approach 1:
The patent substitutes harsh chemical and thermal debonding methods with an electrical field-based approach. The electrolyte-containing adhesive enables faradaic reactions when electrical potential is applied, creating a controlled electrochemical debonding process that avoids the aggressive chemicals and high temperatures that damage substrates
Solution Approach 2:
The electrolyte acts as an intermediary that enables controlled electrochemical reactions at the adhesive-substrate interface. This intermediary substance allows the electrical field to trigger debonding through ionic conduction and faradaic reactions, providing a gentle alternative to direct chemical or thermal attack on the substrate-adhesive bond
3Adaptability or versatility
If electrolyte is added to enable electrical debonding, then debondability is improved, but adhesive composition complexity increases
Solution Approach 1:
The patent merges the adhesive and electrolyte functions into a single integrated composition. The electrolyte is incorporated directly into the adhesive matrix, combining the bonding and debonding capabilities in one material system, eliminating the need for separate electrolyte application or complex multi-component systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition effectively bonds substrates and can be conveniently debonded by applying an electrical potential, maintaining substrate integrity.
Implementation Method 1
the electrolyte provides sufficient ionic conductivity to the composition to support a faradaic reaction at a bond formed between the composition and an electrically conductive surface
Implementation Method 2
support a faradaic reaction at a bond formed between the composition and an electrically conductive surface and thus allows the composition to disbond from the surface
Data Source
AI summary
The present invention is directed to a curable and debondable two-part (2K) adhesive composition comprising: i) a first part comprising: a) epoxy resin; b) an electrolyte; c) optionally, a solubilizer; and, ii) a second part comprising: a) a curing agent consisting of at least one compound possessing at least two epoxide reactive groups per molecule; and, b) an accelerator; wherein said composition further comprises an electrically non-conductive filler and, optionally a toughener.