Epoxy Resin Adhesives TRIZ Cases

Controlled inorganic filler sizing keeps epoxy underfill low in viscosity, fills sub-40 μm gaps, and reduces thermal-stress failures.

A heat-activated 1K epoxy bonds graphite monopolar plates quickly while maintaining gas-tight, chemically resistant bipolar plate joints.

Using oxetane-epoxy dual curing, this adhesive bonds heat-sensitive camera parts at 120°C or less without toxic antimony compounds.

A halogen-free epoxy blend forms an intumescent char to improve FST performance, preserve strength, and enable lower-temperature curing.

A levulinic-acid-derived epoxy blend raises bio-based content while preserving low viscosity, flexibility, fast cure, and mechanical strength.

Discrete conductive adhesive members on a black-shade film connect LED pads at lower cost while reducing optical cross-talk and improving contrast.

An energy-activated epoxy polymer and nonreactive fluoropolymer improve one-component adhesive stability while delivering strong structural bonds.

Heat-activated microspheres weaken epoxy bonds at controlled temperatures, enabling fast substrate separation without mechanical damage.

Partial NCO blocking improves epoxy toughening by avoiding chain-stopping residues, preserving low viscosity, strength, and storage stability.

Sterically hindered phenolate curing enables one-part epoxy compositions with long pot life, low-temperature activation, and lower toxicity.

UV and moisture curing are combined in one epoxy oligomer to fully cure shadowed bond areas without heat, improving bond strength in sensitive assemblies.

A toughened epoxy adhesive uses polyamine curing and glycerol-carbonate polyurethane to bond quickly at room temperature without losing strength.

A tuned amine-curing epoxy bonds untreated soft PVC membranes directly to substrates while maintaining heat and moisture resistance.

A modified 1K epoxy adhesive uses flexibilized resin, core shell rubber, and dicyandiamide to bond inclined surfaces without support fixtures.

A two-part epoxy and polyetheramine shimming adhesive fills irregular gaps and carries structural loads in one assembly step.

Core-shell graft copolymer powder dispersion helps bio-based epoxy resin compositions retain strength while cutting solvent-related cost and pollution.

Diketone-functional multistage particles and dihydrazide crosslinking improve block resistance, hardness, and dirt pick-up resistance in low-VOC epoxy coatings.

Acid-triggered curing combines epoxy resins with fire-resistance additives to preserve mechanical properties while limiting additive loading.

Composite polyamide curing agents keep epoxy compositions single-phase for over six months while retaining lap shear strength on epoxy and steel.

Weak vibration damping in vehicle adhesives is addressed with a multi-resin epoxy blend containing a phenol-group compound.

Polar thermoplastic particles help heat-curing epoxy compositions improve tensile strength, impact peel values, and elevated-temperature storage stability.

Thermally expandable microspheres weaken strong epoxy bonds when heated, enabling e-mobility disassembly while protecting substrates.

Shell particles help one-component epoxy adhesives retain lap shear and impact peel strength while limiting viscosity increase during humid storage.

A solventless epoxy-terminated polyester and amine curative maintain application viscosity and pot-life stability without isocyanates.

Short-chain segments plasticize silane-terminated resin internally, lowering viscosity while maintaining sealant strength.

Controlled resin and curing-agent ratios deliver rapid setting and strong adhesion for concrete anchors across 5°C to 80°C.

A low-viscosity transparent epoxy fills display gaps by ink-jetting or dispensing, then cures with strong adhesion and low gas generation.

Aminimide-functional compounds activate epoxy curing on demand, balancing storage stability, bond strength, and easy application.

A toughened, filled two-component epoxy cures at 100°C or below to reinforce metal structures and resist fatigue-driven adhesive failure.

Low-molecular-weight imide oligomers with crosslinkable groups improve uncured processability while supporting adhesion and heat resistance after cure.

This 2K epoxy adhesive uses an electrolyte to enable controlled electrical debonding without damaging bonded substrates.

A segmented epoxy-polyester and amine-curative adhesive supports one-shot lamination with stable viscosity, pot life, and strong bonding.

This case uses a structured epoxy imidazole adduct to extend pot life, improve moisture resistance, and limit bisphenol A generation.

Short chain segments lower resin viscosity for extrusion and higher calcium carbonate loading while preserving tensile performance.

Epoxy-modified nitrile rubber helps balance uncured tack and cured bond strength, with cationic photoinitiators supporting UV-LED curing.

This case shows how graphene-based or hydrophilic modifiers speed heat- or water-induced curing without extra hardeners or catalysts.

This 2K epoxy composition combines MXDA, diamines, and phenolic resin to reduce toxicity while retaining chemical and thermal resistance.

Tape-cast filled elastomer accommodates thermal expansion mismatches and enables rework without excessive adhesive flow.

A two-component epoxy system uses a tertiary amine hardener to accelerate curing kinetics without primary or secondary amines.

Camphorquinone and coumarin sensitizer activate a photolatent amine to resolve slow gel formation in base-curable resin systems.

Furan-based curing agents eliminate benzyl alcohol from epoxy formulations, preventing amine blushing while maintaining glossy surfaces at low temperatures.

Terminally blocked polyurethane prepolymers increase the maximum linear expansion of single component heat-curing epoxy resin compositions.

Cyclic carbonic acid amine accelerators resolve the contradiction between rapid curing speed and storage stability in heat-curable epoxy resin compositions.

Core-shell rubber particles and amine-terminated polyethers toughen the epoxy matrix, maintaining bond strength under impact stress at -40°C.

Segregating IPDA and MXDA reactions eliminates mixed adducts, ensuring regulatory compliance while maintaining workable viscosity.

Pulsed laser irradiation cures epoxy adhesive while maintaining surface temperature below decomposition point, preventing thermal damage during rapid curing.

An azo compound or pH dye integrated into the adhesive composition provides visual cues to determine the curing endpoint without mechanical testing.

Surface phosphorus compounds on epoxy resin frames improve bonding strength against high-altitude pressure differences that cause peeling.

Siloxane epoxy composition reacts with ring-opening functional groups to resolve adhesive strength and heat resistance trade-offs.

Benzofuran epoxy resin compositions combine polyepoxide resins with chain extension agents to produce cured materials with enhanced mechanical properties.

Novel amine hardener cures epoxy resin rapidly at room temperature, resolving slow curing speed and insufficient final hardness trade-offs.