Epoxy Resin Adhesives TRIZ Cases
- Epoxy Underfill Resin Composition for Narrow Gap Packaging
Controlled inorganic filler sizing keeps epoxy underfill low in viscosity, fills sub-40 μm gaps, and reduces thermal-stress failures.
Controlled inorganic filler sizing keeps epoxy underfill low in viscosity, fills sub-40 μm gaps, and reduces thermal-stress failures.