Phosphorus-Modified Epoxy Resin Frame for Sealing Plate Adhesion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The semiconductor module's sealing plate is prone to deformation and peeling off at the interface with the resin frame due to pressure differences at high altitudes, leading to reduced bonding reliability.
Innovation Solution
A bonded body is created using a first adherend with a molded epoxy resin surface and a second adherend bonded via an adhesive portion, both containing epoxy resin, with an organic phosphorus compound present on the surface of the first adherend to enhance adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the sealing plate is made thin to reduce weight and size, then the compactness is improved, but the bonding reliability deteriorates due to deformation and peeling at the interface
Solution Approach 1:
The invention applies a phosphorus compound specifically to the surface of the resin frame at the bonding interface with the sealing plate, creating a localized adhesion-enhancing layer. This local modification improves bonding reliability at the critical interface without requiring the entire sealing plate to be thicker, thus maintaining compactness while preventing peeling.
Solution Approach 2:
The invention changes the chemical parameter of the resin frame surface by introducing a phosphorus compound, which modifies the surface properties to enhance adhesion. This parameter change (chemical composition of surface) improves bonding strength without altering the physical dimension (thickness) of the sealing plate, resolving the contradiction between size and reliability.
2Strength
If adhesive amount is increased to improve bonding strength, then the bonding reliability is improved, but the manufacturing precision deteriorates due to adhesive overflow and positioning difficulty
Solution Approach 1:
The invention changes the chemical parameter of the resin frame surface by introducing a phosphorus compound, which modifies the surface properties to enhance adhesion. This parameter change (chemical composition of surface) improves bonding strength without altering the physical dimension (thickness) of the sealing plate, resolving the contradiction between size and reliability.
3Reliability
If the resin frame and sealing plate are bonded tightly to ensure sealing, then the sealing performance is improved, but the stress concentration increases leading to interface peeling under pressure difference
Solution Approach 1:
The invention applies a phosphorus compound specifically to the surface of the resin frame at the bonding interface with the sealing plate, creating a localized adhesion-enhancing layer. This local modification improves bonding reliability at the critical interface without requiring the entire sealing plate to be thicker, thus maintaining compactness while preventing peeling.
Solution Approach 2:
The invention creates a composite structure at the bonding interface by combining the resin frame with a phosphorus compound layer. This composite interface has enhanced adhesion properties that can withstand pressure differences, maintaining both sealing performance and interface strength simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The bonded body achieves improved bonding reliability by enhancing the adhesion between the resin frame and the adhesive, thereby reducing the likelihood of peeling and maintaining structural integrity under varying pressure conditions.
Implementation Method 1
a first adherend containing an epoxy resin; and a second adherend that is bonded to the first adherend via an adhesive portion containing an epoxy resin, wherein the first adherend is a molded body having a phosphorus compound on its surface
Data Source
AI summary
A bonded body according to the present disclosure, includes: a first adherend containing an epoxy resin; and a second adherend that is bonded to the first adherend via an adhesive portion containing an epoxy resin, wherein the first adherend is a molded body having a phosphorus compound on its surface.