Epoxy Underfill Resin Composition for Narrow Gap Packaging
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Solution Overview
Problem
Existing packaging materials face challenges in filling narrow gaps of less than 40 μm in advanced electronic packaging structures, leading to issues such as air hole generation and filler settlement, which affect packaging reliability and chip failure due to thermal stress.
Innovation Solution
A resin composition comprising epoxy resin, a curing agent, and inorganic filler with controlled particle sizes (D10, D50, and D90) and specific surface area, ensuring low viscosity and high fluidity, which forms a uniform underfill adhesive layer to fill narrow gaps and alleviate thermal stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If packaging material is used to fill narrow gaps in advanced electronic packaging, then insulation and bonding functions are achieved, but air hole generation and filler settlement occur leading to poor filling capability
Solution Approach 1:
The patent changes the particle size parameters of the inorganic filler, specifically controlling D10, D50, and D90 within specific ranges, to optimize the resin composition's flow and filling properties while preventing settlement and air hole formation in narrow gaps
Solution Approach 2:
The patent uses a composite resin composition comprising epoxy resin, curing agent, and inorganic filler with specific particle size distribution, creating a material that combines the adhesive properties of epoxy with the flow characteristics enabled by the controlled filler distribution
2Manufacturing precision
If inorganic filler with small particle size is added to improve filling capability, then narrow gap filling is enhanced, but viscosity increases and fluidity decreases
Solution Approach 1:
The patent optimizes the particle size distribution parameters (D10, D50, D90) of the inorganic filler to achieve a balance where the filler provides sufficient flow characteristics for narrow gap filling while maintaining acceptable viscosity and fluidity for proper application
Solution Approach 2:
The patent applies different particle size characteristics to different portions of the filler distribution, with a specific focus on controlling the fine particle fraction (D10) to enhance flow while the overall distribution (D50, D90) provides structural stability and prevents excessive viscosity increase
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition effectively fills narrow gaps without air holes, enhances packaging reliability by reducing thermal stress, and improves service reliability of electronic components.
Implementation Method 1
The resin composition has a narrow gap filling capability, and can be used as a packaging material for packaging an electronic component... to implement narrow gap filling
Implementation Method 2
A cut-off particle size of the inorganic filler is 3 μm, D10 of the inorganic filler ranges from 0.1 μm to 0.4 μm, D50 ranges from 0.5 μm to 1.1 μm, and D90 ranges from 1.3 μm to 2.9 μm... the resin composition still has a low viscosity and high fluidity
Implementation Method 3
alleviate an internal stress problem caused by mismatch of coefficients of thermal expansion (CTE) of the chip, the soldering bump, and the substrate
Data Source
AI summary
Embodiments of this disclosure provide a resin composition. The resin composition includes epoxy resin, a curing agent, and an inorganic filler. A cut-off particle size of the inorganic filler is 3 μm, D10 of the inorganic filler ranges from 0.1 μm to 0.4 μm, D50 of the inorganic filler ranges from 0.5 μm to 1.1 μm, and D90 of the inorganic filler ranges from 1.3 μm to 2.9 μm. The resin composition has a low viscosity and high fluidity, and has a good narrow gap filling capability. Embodiments of this disclosure further provide disclosure of the resin composition.