Curable Resin Composition with Low-Molecular-Weight Imide Oligomer
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Solution Overview
Problem
Existing curable resin compositions lack flexibility and processability before curing, and adequate adhesiveness, heat resistance, and dielectric characteristics after curing, which are essential for electronic device applications.
Innovation Solution
A curable resin composition using an imide oligomer with a specific structure and molecular weight, containing aliphatic diamine or triamine residues, and crosslinkable functional groups, enhances flexibility and processability before curing, and adhesiveness, heat resistance, and dielectric characteristics after curing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If imide oligomers are used as curing agents in curable resin compositions, then adhesiveness and heat resistance are improved, but flexibility and processability at room temperature deteriorate due to the hard and brittle nature of imide oligomers
Solution Approach 1:
The invention changes the molecular weight parameter of the imide oligomer from conventional high values to specifically 5,000 or less. This parameter change transforms the imide oligomer from a hard and brittle state to a state that provides both good flexibility and processability at room temperature while maintaining adhesiveness and heat resistance after curing.
Solution Approach 2:
The invention creates a composite curing agent system by combining imide oligomer (molecular weight 5,000 or less) with epoxy resin. This composite material approach allows the imide oligomer to provide crosslinking and adhesion while the lower molecular weight ensures adequate fluidity and flexibility before curing.
2Ease of operation
If liquid epoxy resin content is increased to improve fluidity, then processability is improved, but heat resistance and adhesiveness deteriorate
Solution Approach 1:
Instead of changing the epoxy resin composition, the invention changes the molecular weight parameter of the imide oligomer curing agent to 5,000 or less. This allows the formulation to maintain low liquid epoxy resin content (preserving heat resistance and adhesiveness) while achieving adequate fluidity through the optimized imide oligomer characteristics.
3Ease of operation
If nitrile rubber component is dispersed to improve flexibility before curing, then flexibility and processability are improved, but heat resistance of the cured product deteriorates
Solution Approach 1:
The invention replaces the nitrile rubber flexibility enhancement approach with a molecular weight optimization approach for the imide oligomer. By setting the imide oligomer molecular weight to 5,000 or less, the invention achieves flexibility before curing without introducing components that would compromise heat resistance after curing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves improved flexibility and processability before curing, and superior adhesiveness, heat resistance, and dielectric characteristics after curing, suitable for electronic devices.
Implementation Method 1
a curable resin composition containing an epoxy resin and an imide oligomer having a specific reactive functional group
Implementation Method 2
an imide oligomer... having a crosslinkable functional group at an end
Data Source
AI summary
The present invention aims to provide a curable resin composition excellent in flexibility and processability before curing and excellent in adhesiveness, heat resistance, and dielectric characteristics after curing. The present invention also aims to provide an adhesive, an adhesive film, a circuit board, an interlayer insulating material, and a printed wiring board each produced using the curable resin composition. Provided is a curable resin composition containing: a curable resin; and a curing agent containing an imide oligomer, the imide oligomer containing an aliphatic diamine residue- and/or aliphatic triamine residue-containing imide oligomer that has, in a main chain, an imide skeleton and a substituted or unsubstituted aliphatic diamine residue having a carbon number of 4 or greater and/or a substituted or unsubstituted aliphatic triamine residue having a carbon number of 4 or greater, has a crosslinkable functional group at an end, and has a molecular weight of 5,000 or less.