Laser Curing of Epoxy Adhesive with Temperature Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for curing cationically polymerizable epoxy resin compositions either require long curing times or risk adhesive decomposition due to rapid temperature increases during laser irradiation.
Innovation Solution
A method involving the irradiation of a cationically polymerizable epoxy resin composition with a UV, visible, or infrared laser, while maintaining the surface temperature between 25°C higher than the curing reaction peak temperature and 275°C, using a composition comprising an epoxy resin and an acid generator.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a laser beam is used to cure a cationically polymerizable epoxy adhesive composition, then the curing time is shortened, but the temperature of the adhesive continues to rise rapidly and the adhesive may decompose before sufficient curing strength is obtained
Solution Approach 1:
The patent applies periodic action by using pulsed laser irradiation instead of continuous laser exposure. The laser is irradiated in multiple pulses with specific intervals, allowing the adhesive to cure while preventing excessive temperature accumulation that would cause decomposition. This periodic irradiation pattern enables sufficient curing strength to be achieved without thermal damage.
Solution Approach 2:
The patent changes the temperature parameter by controlling and limiting the maximum temperature during laser curing. Specifically, the adhesive temperature is maintained below its decomposition point while still achieving adequate curing. This parameter control resolves the contradiction by finding an optimal temperature window that enables fast curing without thermal degradation.
2Reliability
If UV irradiation is used to cure an epoxy adhesive, then the adhesive can be temporarily cured to prevent optical axis shift, but the curing process requires long time which reduces production efficiency
Solution Approach 1:
The patent replaces the conventional UV light-based curing mechanism with a laser-based curing system. This substitution enables much faster energy delivery to the adhesive, reducing curing time from minutes to seconds while still achieving sufficient initial cure to stabilize the optical axis. The laser's concentrated energy delivery overcomes the slow curing limitation of UV irradiation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables rapid and efficient curing of the epoxy adhesive without decomposition, improving production efficiency and ensuring strong adhesion.
Implementation Method 1
irradiating a cationically polymerizable epoxy resin composition with a UV, visible or infrared laser
Implementation Method 2
a cationically polymerizable epoxy resin composition comprises: (A) an epoxy resin; and (B) an acid generator
Data Source
AI summary
The present invention relates to a method for curing a cationically polymerizable epoxy resin composition, the method comprising: irradiating a cationically polymerizable epoxy resin composition with a UV, visible or infrared laser, and maintaining the temperature of the cationically polymerizable epoxy resin composition between 25°C higher than the curing reaction peak temperature of the cationically polymerizable epoxy resin composition as measured by differential scanning calorimetry and 275°C, wherein the cationically polymerizable epoxy resin composition comprises: (A) an epoxy resin; and (B) an acid generator.