3D Alignment Features for Passive Opto-Electronic Component Positioning
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Solution Overview
Problem
Current methods for aligning opto-electronic components, such as active alignment and passive alignment using expensive machine vision and robotics, are costly and inefficient, especially as data rates increase and optical interconnections become preferred over copper lines.
Innovation Solution
The use of three-dimensional (3D) alignment features on integrated circuit (IC) dies and optical ports that mate complementarily to establish stable relative positions, allowing for precise alignment without the need for expensive alignment tools, using standard lithographic techniques to form alignment features that ensure optical communication within tight tolerances.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If active alignment is used to achieve precise alignment between optical components, then alignment precision is improved, but manufacturing cost and time increase significantly
Solution Approach 1:
Alignment features are formed on the IC die during the semiconductor fabrication process using standard lithographic techniques, before the optical components are assembled. This preliminary formation of alignment features eliminates the need for expensive post-assembly active alignment processes, achieving both high precision and low cost.
Solution Approach 2:
The patent replaces the mechanical trial-and-error adjustment process of active alignment with a predetermined geometric alignment system. Complementary alignment features (protrusions and recesses) provide mechanical guidance that automatically positions optical components with sub-micron precision without requiring expensive alignment equipment or iterative adjustment.
2Manufacturing precision
If machine vision and 6-axis robotics are used for passive alignment to meet stringent alignment tolerances, then alignment precision is improved, but device complexity and cost increase
Solution Approach 1:
The alignment features on the IC die and optical components are designed to be self-aligning through complementary geometries (protrusions fitting into recesses). This self-service alignment mechanism eliminates the need for external machine vision systems and 6-axis robotics, achieving sub-micron precision with simple mechanical guidance.
Solution Approach 2:
The patent introduces vertical dimension alignment features (protrusions and recesses extending in the Z-direction) that provide three-dimensional mechanical guidance. This 3D geometric constraint system replaces complex 2D machine vision and robotic positioning, achieving precise alignment through straightforward mechanical interlocking.
3Ease of manufacture
If standard lithographic techniques are used to form alignment features on IC dies, then ease of manufacture is improved, but alignment precision may be insufficient for tight tolerances
Solution Approach 1:
Alignment features are formed during the standard IC fabrication process using conventional lithographic techniques, before the die is packaged or tested. This preliminary formation ensures that alignment features are precisely defined with sub-micron accuracy using well-established semiconductor manufacturing processes, eliminating the need for post-fabrication alignment adjustments.
Data Source
AI summary
A method for aligning an opto-electronic component in an IC die with an optical port is disclosed. This is achieved, in various embodiments, by forming alignment features in the IC die that can mate with complementary alignment features of the optical port. The formation of alignment features can be performed at the wafer level during fabrication of the IC die. An optical signal carrier may be optically coupled to the optical port such that the signal carrier may communicate optically with the opto-electronic component.