Printed Circuit Assembling TRIZ Cases

An elastic washer sandwiched between flat washers prevents rattling and maintains ground potential contact under vibration.

Pre-formed resin voids anchor melted solder to reinforce joints, overcoming inefficient conventional reinforcement methods.

Discrete adhesive points eliminate epoxy gel air bubbles while insulating layers reduce isolation distance to 0.4 mm for reliable high-voltage operation.

Silicone resin protective member covers electrode pads and bonding wires on sensor modules.

Transparent foil embeds light-emitting components to prevent short-circuiting while enabling flexible module assembly.

Replacing ceramic substrates and long aluminum bond wires with a copper-based structure featuring short vias reduces breakage risk and electrical resistance.

Adhesive gel bonds copper foils to eliminate metal carriers, reducing costs and improving yield.

A transistor outline housing uses a recessed pin structure to create additional inductance for signal path impedance.

Replacing soldered wires with a flexible circuit board eliminates assembly complexity and reduces scrap rates.

Multilayer power transmission board uses conductive outer layers and plating to form a shielded structure for efficient power delivery.

Soldering pin headers and alignment pins onto avionics PCBs secure small form factor pluggable transceivers against mechanical detachment.

Friction welding flat conductive elements onto circuit boards creates hybrid wiring layers for high current conduction.

Bending free conducting ends projecting from thinned supports eliminates back-face pads, reducing fabrication complexity and chip area usage.

Embedding components in board cavities with adhesive layers reduces package volume while maintaining electrical connectivity and production uniformity.

A sensor uses a sealing grommet with an axial hole to access calibration points before final encapsulation.

Core-based double-sided lamination processes laminate structures simultaneously, eliminating dummy side waste and boosting productivity.

Replacing screw attachment with a horizontal recess-fit mechanism reduces nozzle base thickness and downward movement stroke.

Replacing laser opening formation with dry film resist patterning eliminates thermal damage to conductor pads and boosts manufacturing productivity.

Cylindrical conductor posts replace spherical solder balls to enable fine pitch wiring on printed wiring boards.

A mounting system calculates positional shifts between electrodes and printed solder to adjust placement coordinates.

A three-dimensional heat-dissipating base and potting glue secure electromagnetic modules, preventing component detachment from vibration.

Complementary 3D alignment features on IC dies mate with optical ports, eliminating expensive machine vision and robotics while achieving sub-micron precision.

Concavo-convex solder-resist edges intersect conductive patterns, eliminating void formation that compromises insulation reliability in compact wiring boards.

A MOSFET stack package assembles multiple semiconductor devices on opposite sides of a printed circuit board to maximize chip density.

Curved guide vanes create spiral flow to overcome horizontal inertia, ensuring uniform widthwise distribution of the jetting height.

Segmenting the substrate allows pre-inspection of integrated circuit elements before resin encapsulation, resolving manufacturing cost and yield trade-offs.

Dispersed Ni-Sn alloy phases with micro-holes prevent solder scattering and crack propagation in electronic circuit module components.

A control system selects synchronous or asynchronous production modes based on real-time mounting data to optimize throughput.

A rotatable précising mechanism aligns electronic components by matching jaw orientation to initial component position before final rotation.

A circuit board expansion slot forms a closed electromagnetic loop with the card to contain interference waves.

Step-height circuit patterns and non-conductive paste prevent short-circuits in fine-pitch assemblies, eliminating tin plating costs.

Intermittent transport moves work sequentially through preheater, melting heater, and cooler sections to reduce temperature differences within the work.

Integrating a flexible printed circuit board directly into a through mold via substrate.

A halo-hydrocarbon polymer coating protects printed circuit board conductive tracks from oxidation and corrosion.

Contiguous via conductors bridge rigid boards through interlayer insulation, reducing manufacturing complexity while maintaining connection reliability.

A scraping squeegee coated with a nonwoven fabric transfers cream solder, preventing shape deformation during mask replacement.

Optimized Au-Sn-Ag composition reduces raw material costs while maintaining heat resistance, resolving trade-offs in high-temperature electronic packaging.

Segmented mounting lanes enable concurrent production of diverse substrates, resolving the trade-off between mass productivity and product flexibility.

A multilayer printed wiring board capacitor section uses nickel and copper electrodes to suppress power source line potential falloff.

Merging the base structure with the circuit board eliminates separate components, reducing overall size while maintaining support stability.

Stepped lead terminals with asymmetric lower surface spacing suppress solder bridges and prevent terminal detachment in compact flip chip packages.

Lateral heat dissipation via terminal electrodes reduces module thickness while maintaining electrical characteristics.

A Sn-Ag-Cu solder cream mixes distinct silver alloys to create reliable joints.

Visual recognition windows in the resin support structure allow direct solder inspection, eliminating external jigs and reducing production complexity.

A circuit module embeds components in resin and connects a metal shield to power patterns via vertical through conductors.

A glass-based antenna array package uses a single substrate layer with a photoimageable dielectric encapsulation.

Modular circuit boards with isolation transformers shield silicon carbide gate drivers from electromagnetic interference noise.

Precise In and Sb parameter control resolves wettability-strength trade-offs, ensuring high bonding reliability on glass substrates.