Package Carrier Copper Foil Lamination Process
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Solution Overview
Problem
The high cost and complexity of manufacturing multi-layered circuit boards due to the use of metal carriers and the difficulty in removing adhesive gel, which affects the yield and uniformity of copper layers formed by the copper plating method.
Innovation Solution
A method involving copper foil layers bonded using adhesive gel or welding, with through holes and dielectric/conductive layers compressed to form circuit layers without a carrier, allowing for easier gel removal and improved copper thickness uniformity through patterning and lamination processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If metal is used as supporting carrier, then structural strength is improved, but manufacturing cost increases
Solution Approach 1:
The patent removes the metal carrier from the circuit board structure, extracting only the essential supporting function and replacing it with a combination of dielectric layers and copper foils that provide both structural integrity and electrical functionality without the high cost of metal carriers
Solution Approach 2:
The dielectric layers and copper foils serve multiple functions simultaneously: providing structural support, enabling electrical connections, and reducing manufacturing cost, thereby replacing the single-function metal carrier with a multi-functional composite structure
2Strength
If mass of gel is used to fix copper foil, then adhesion is improved, but gel removal difficulty increases
Solution Approach 1:
The patent eliminates the mass gel application step entirely, extracting the adhesion function and replacing it with mechanical bonding through compression lamination, which achieves sufficient adhesion without the removal difficulties associated with gel
Solution Approach 2:
The chemical adhesion mechanism of gel is replaced with a mechanical bonding system using compression lamination, where pressure and heat are applied to bond layers together, providing adhesion without the need for chemical gel removal processes
3Reliability
If copper plating method is used, then electrical conductivity is improved, but copper layer thickness uniformity deteriorates
Solution Approach 1:
Instead of building up copper thickness through sequential plating layers (bottom to top), the patent inverts the approach by starting with a predetermined uniform copper foil thickness and then patterning it to the required circuit geometry, ensuring uniformity is achieved before electrical functionality is added
4Manufacturing precision
If thinning process is performed to decrease copper layer thickness, then thickness precision is improved, but number of process steps increases
Solution Approach 1:
The patent performs the thickness determination action in advance by selecting copper foil with the required thickness from the beginning, rather than adding thickness through plating and then removing excess material, thereby achieving the desired precision without subsequent thinning processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces manufacturing costs, simplifies the process, increases yield, and enhances the reliability of the package carrier by eliminating the need for metal carriers and improving copper layer uniformity.
Implementation Method 1
The second foil layer is partially glued to the fourth copper foil layer by an adhesive gel
Implementation Method 2
a first dielectric layer and a first conductive layer disposed thereon are compressed on the first copper foil layer, and a second dielectric layer and a second conductive layer disposed thereon are compressed on the third copper foil layer
Implementation Method 3
the adhesive gel is removed to from a first carrier unit
Data Source
AI summary
A manufacturing method of package carrier is provided. A first copper foil layer, a second copper foil layer on the first foil layer, a third copper foil layer and a fourth foil layer on the third foil layer are provided. The second copper foil layer is partially bonded the fourth copper foil layer by an adhesive gel so as to form a substrate of which the peripheral region is glued and the effective region is not glued. Therefore, the thinner substrate can be used in the following steps, such as patterning process or plating process. In addition, the substrate can be extended be the package carrier structure with odd-numbered layer or even-numbered layer.