Integrated Electrical Holder Camera Module Size Reduction
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Solution Overview
Problem
Conventional camera modules face challenges with size enlargement due to the need for a base structure, complex manufacturing processes, vulnerability to external factors like dust, and increased component count, which affects image quality and service life.
Innovation Solution
A camera module design that integrates an electrical holder with the circuit board, eliminating the conventional base structure, and embedding electrical components like resistances, capacitances, and driver chips within the holder to reduce size and enhance durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a conventional base structure is used to support electronic components, then the supporting function is provided, but the overall size of the camera module becomes larger
Solution Approach 1:
The patent merges the base structure with the circuit board by directly mounting electronic components onto the circuit board, eliminating the need for a separate base structure. This integration reduces the overall volume while maintaining the supporting function through the circuit board itself.
Solution Approach 2:
The circuit board is designed to serve multiple functions: it acts as both the mounting platform for electronic components and the structural base of the camera module. This multi-functionality eliminates the need for a dedicated base structure, reducing overall size while maintaining support capabilities.
2Ease of manufacture
If electronic components are arranged on the surface of the circuit board without overlapping, then the assembly is simple, but the overall size of the camera module becomes larger
Solution Approach 1:
The patent transitions from two-dimensional surface mounting to three-dimensional stacked arrangement, where electronic components are positioned at different vertical levels. This allows components to overlap in the plan view while being separated vertically, significantly reducing the footprint area while maintaining manufacturing feasibility through standardized stacking processes.
Solution Approach 2:
The patent arranges electronic components in a nested configuration where smaller components are positioned within the bounding box of larger components, and components are stacked vertically like nested dolls. This maximizes space utilization and reduces the overall camera module size while keeping the assembly process relatively simple.
3Measurement precision
If the chip area is increased to achieve higher pixel, then the image quality is improved, but the number of electronic components increases and the overall size becomes larger
Solution Approach 1:
The patent combines multiple electronic components (photosensitive chip, motor driver, resistors, capacitors) onto a single circuit board in a compact stacked arrangement. This integration reduces the total component count and simplifies the device structure while allowing the photosensitive chip to be optimized for high pixel density and image quality.
Solution Approach 2:
By arranging components in three dimensions with vertical stacking, the patent allows the photosensitive chip to be positioned at an optimal location for high pixel density without requiring proportional increases in overall device footprint. The vertical arrangement accommodates additional components without increasing the planar area, thus maintaining compact size despite increased functionality.
4Stability of the object's composition
If a base structure is enlarged to provide better supporting function, then the support stability is improved, but the overall size of the camera module becomes larger
Solution Approach 1:
The patent eliminates the separate base structure by integrating support functions into the circuit board. The circuit board is designed with reinforced mounting areas and optimized structural layout to provide adequate support stability without requiring an enlarged dedicated base, thus maintaining compact overall dimensions.
Solution Approach 2:
The circuit board employs local reinforcement and optimized structural design at critical mounting points to provide sufficient support stability. Instead of uniformly enlarging the entire base structure, the patent applies enhanced local support where needed, maintaining overall compact size while ensuring adequate stability for electronic components.
Data Source
AI summary
A camera module includes a lens, a photosensitive chip and an electrical holder. The electrical holder has an integrated circuit that the electrical holder serves as an integration of a base and a PCB in a conventional camera module, wherein the electrical holder not only forms an assembling unit for connecting a motor and an optical lens but also forms an electrical connection unit for electrically connecting to the motor, a photosensitive chip and a flexible circuit board with each other, so as to minimize an overall size of the camera module.