Electronic Component Module Lateral Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic component modules face challenges in effectively dissipating heat generated by heating elements, such as CPUs or power amplifiers, which can deteriorate electrical characteristics and are exacerbated by sealed resin layers, reduced module thickness, or the inability to mount a heat sink on the heating element.
Innovation Solution
The solution involves an electronic component module design that includes a board with a first electronic component as a heating element, a second electronic component with a heat transfer portion connected to both terminal electrodes, and a heat dissipation portion connected to the board via these electrodes, allowing for efficient heat transfer and dissipation without requiring a heat sink on the top surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat sink is provided on the top surface of a heating element, then heat dissipation is improved, but the module thickness increases and the device becomes more complex
Solution Approach 1:
The patent transitions from vertical heat dissipation (top-surface heat sink) to lateral heat dissipation (side-surface heat sink). The heat dissipation portion is positioned adjacent to the heating element in the planar direction rather than above it, utilizing the lateral dimension for heat transfer while maintaining thin profile in the vertical direction.
Solution Approach 2:
The heat dissipation portion serves multiple functions: it acts as both a thermal management component and an electromagnetic shield. By integrating the heat dissipation function with the shielding function, the patent reduces the need for separate components that would increase thickness and complexity.
2Temperature
If a heat sink is provided on the top surface of a heating element, then heat dissipation is improved, but the device structure becomes more complex
Solution Approach 1:
The patent combines the heat dissipation function with the electromagnetic shielding function into a single integrated component. The heat dissipation portion is formed as an integral part of the module structure, merging thermal management and EMI shielding functions that would traditionally require separate components.
Solution Approach 2:
The heat dissipation portion serves multiple functions simultaneously: thermal conduction away from the heating element and electromagnetic shielding for sensitive components. This multi-functionality reduces the total component count and simplifies the overall device structure.
3Length of stationary object
If the module thickness is reduced, then the device becomes more compact, but heat dissipation capability deteriorates
Solution Approach 1:
The patent compensates for reduced vertical heat dissipation capacity by enhancing lateral heat dissipation. The heat dissipation portion extends in the planar direction adjacent to the heating element, utilizing the horizontal dimension to maintain effective heat transfer despite reduced module thickness.
4Productivity
If high-density component mounting is implemented, then productivity is improved, but heat dissipation becomes more difficult
Solution Approach 1:
The patent divides the heat dissipation function into multiple segments: the heating element, the heat transfer portion (intermediate thermal pathway), and the heat dissipation portion (final heat sink). This segmented approach allows efficient heat distribution across the module, accommodating high-density component layouts while maintaining thermal management effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces or prevents the deterioration of electrical characteristics by efficiently dissipating heat, even with high heat generation or reduced module thickness, and allows for high-density component mounting without the need for additional heat sinks.
Implementation Method 1
The heat transfer portion is disposed on the second surface of the second electronic component, the heat transfer portion being connected to both the first terminal electrode and the second terminal electrode. The heat dissipation portion is connected to the board via the first terminal electrode, the second terminal electrode, and the heat transfer portion.
Data Source
AI summary
An electronic component module includes a second terminal electrode that is independent of a first terminal electrode in terms of potential. A second electronic component is mounted on a board, with a first surface thereof facing the board. A heat transfer portion is disposed on a second surface of the second electronic component, the heat transfer portion being connected to both the first terminal electrode and the second terminal electrode. A heat dissipation portion is connected to the board via the first terminal electrode, the second terminal electrode, and the heat transfer portion.