Multifunctional Printed Circuit Board with Friction Welded Wiring
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Solution Overview
Problem
Conventional printed circuit board technology faces challenges in cost-effectively producing multifunctional boards that integrate highly complex, fine conductor structures capable of carrying high currents while also efficiently dissipating heat, as existing methods like etching are inefficient and lead to thermal stress and warping due to thin wire cross-sections.
Innovation Solution
The integration of additional functional elements, such as flat, thermally conductive, and bendable wiring elements on or within the circuit board using friction welding or ultrasonic techniques, allowing for the creation of a separate wiring level and enabling heat dissipation, while maintaining a flat surface for fine structures through resin leveling and lamination processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If etching technology is used to produce conductor tracks, then fine conductor structures can be created, but the current-carrying capacity is limited by copper foil thickness and structure width
Solution Approach 1:
The patent combines subtractive etching technology for fine conductor structures with additive wiring elements for high current carrying capacity. The additive elements are integrated with the etched circuit board to create a hybrid structure that achieves both fine geometry and high current capacity simultaneously.
Solution Approach 2:
The patent uses composite material structures by combining thin copper foils for fine patterning with thicker additive wiring elements. This allows different regions of the circuit board to have optimized material properties - thin for precision, thick for current carrying.
2Quantity of substance
If thick copper foils are used for high current carrying capacity, then current capacity increases, but etching technology becomes very complex and inefficient
Solution Approach 1:
The patent merges additive and subtractive manufacturing approaches. Thick copper foils are applied additively in specific regions to provide high current carrying capacity, while etching is used only where fine conductor structures are needed. This avoids the complexity of etching thick foils entirely.
Solution Approach 2:
The circuit board is segmented into different functional regions: areas requiring fine conductor structures use etched thin copper, while areas requiring high current capacity use additive thick copper elements. This segmentation allows each region to be optimized independently without compromising the other.
3Reliability
If round lead wires are connected to copper plates with weld or bond, then electrical connection is achieved, but thermal load causes warping in the circuit board area
Solution Approach 1:
The patent changes the geometric parameters of the connection interface from point contact (round wire to plate) to surface contact (flat elements to flat surface). This distributes the thermal load over a larger area, preventing localized overheating and warping while maintaining reliable electrical connection.
Solution Approach 2:
The patent uses flat wiring elements with uniform cross-sections that make homogeneous surface contact with the copper plate. This uniform contact distribution ensures even heat dissipation and prevents localized thermal stress that would cause warping.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of cost-effective, high-current carrying circuit boards with efficient heat dissipation, reducing thermal stress and allowing for both rigid and flexible configurations, thereby enhancing the reliability and functionality of printed circuit boards.
Implementation Method 1
zusammengefügten weiteren funktionellen Elementen (3) auf einer oder beiden Oberflächen und/oder in einem inneren Bereich einer Leiterplatte (1) durch Reibschweißen oder Ultraschallschweißen
Implementation Method 2
zusammengefügten weiteren funktionellen Elementen (3) auf einer oder beiden Oberflächen und/oder in einem inneren Bereich einer Leiterplatte (1) durch Reibschweißen oder Ultraschallschweißen
Implementation Method 3
flache Elemente (3) mit guter Wärmeleitfähigkeit
Implementation Method 4
anschließendem Nivellieren in Form eines Beschichtungs- und/oder eines Laminierungsprozesses
Data Source
Figure 1~2
Figure 3~4b
Figure 5
AI summary
The invention relates to a multifunctional printed circuit board comprising at least one additional functional element in the form of a round or rectangular conductor which is at least partially fastened on an electrically conducting strip conductor structure by ultrasound or friction welding in a mechanical and electrical and thermally conducting and planar manner and in such a fashion that an intermetal compound is formed. The invention also relates to a method for producing said printed circuit board, to its use as a wiring element for complex structures that is suitable for high current conduction and to uses for a specific thermal management.