Electronic Component Mounting System With Segmented Lanes
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic component mounting systems struggle to efficiently switch between mass production of one type of product and producing multiple products in small quantities, failing to achieve high productivity and versatility in responding to diverse demand patterns.
Innovation Solution
An electronic component mounting system is designed with multiple independent printing mechanisms, substrate conveyance mechanisms, and component loading mechanisms, allowing for concurrent operation of multiple mounting lanes with flexible tooling changes and inspections, enabling efficient production of both mass-produced and small-batch products.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single electronic component mounting line is used, then productivity is improved through mass production, but the capability to produce multiple product types is reduced
Solution Approach 1:
The mounting line is divided into multiple independent mounting lanes (first mounting lane, second mounting lane, etc.), each capable of independently processing different substrate types. This segmentation allows simultaneous mass production while maintaining flexibility to handle multiple product types across different lanes.
Solution Approach 2:
Each mounting lane is designed with universal capabilities to handle different substrate types and electronic components. The lanes can be configured for mass production of a single substrate type or switched to produce multiple substrate types, making the entire system multi-functional and adaptable to various production scenarios.
2Productivity
If multiple mounting lanes operate simultaneously, then productivity is improved, but system complexity increases
Solution Approach 1:
The system is segmented into independent mounting lanes with separate control mechanisms. Each lane can be independently controlled and configured, which simplifies the overall system management despite having multiple lanes operating simultaneously. The segmentation allows for modular complexity rather than monolithic complexity.
Solution Approach 2:
The mounting line incorporates dynamic switching capabilities that allow each mounting lane to change its configuration and processing parameters based on the substrate type being produced. This dynamic adaptability enables the system to handle multiple product types while maintaining efficient production, reducing the need for complex static configurations.
3Adaptability or versatility
If frequent tooling changes are performed to switch substrate types, then adaptability is improved, but productivity is reduced due to downtime
Solution Approach 1:
By dividing the mounting line into multiple independent lanes, tooling changes can be performed in one lane without affecting the operation of other lanes. This allows continuous production across the system while individual lanes undergo tooling changes, maintaining overall productivity while providing adaptability.
Solution Approach 2:
The system is designed to prepare and stage tooling changes in advance, allowing mounting lanes to switch between substrate types more quickly. By having tooling ready and pre-configured, the downtime associated with tooling changes is minimized, maintaining both adaptability and productivity.
Data Source
AI summary
It is an object to provide an electronic component mounting system capable of concurrently, efficiently subjecting a plurality of substrates to component mounting operation and accomplishing both high productivity and a capability of addressing production of multiple products. An electronic component mounting system is configured by arranging, on an upstream side of a component loading unit having a plurality of substrate conveyance mechanisms, a screen printer M2 having a plurality of individual printing mechanisms and a coating and inspection machine M4 that applies a coat of a resin for use in boding an electronic component and that inspects a coated state. The coating and inspection machine M4 is equipped with a coating head 15 that performs operation for coating substrates conveyed by substrate conveyance mechanisms 12A and 12B from the screen printer M2 with the resin and an inspection head 16 that performs pre-coating inspection and post-coating inspection.