Integrated Flex PCB via Through Mold Vias
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Solution Overview
Problem
Conventional 3D circuit topologies face challenges in integrating flexible printed circuit boards (flex-PCBs) with main logic boards without incurring a height penalty, which limits their suitability for compact device designs.
Innovation Solution
The integration of a flexible printed circuit board (flex-PCB) directly into a through mold via (TMV) module substrate, allowing for communication pathways through the resin body, eliminates the height penalty and enables a more compact design by sharing interconnect area with other components on the logic board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional interconnect methods (B2B, hand solder, etc.) are used to connect module to flex, then connection is achieved, but height penalty increases and area consumption is large
Solution Approach 1:
The patent merges the flex-PCB directly into the module substrate, eliminating the need for separate interconnect methods. The flex-PCB is integrated into the same substrate as the module components, allowing direct routing of communication pathways through the resin body via TMVs, thereby achieving connection without height penalty while maintaining connection reliability
Solution Approach 2:
The patent transitions from a conventional planar interconnect approach to a three-dimensional routing solution. Communication pathways are routed through the resin body via through-mold vias, utilizing the vertical dimension within the module housing to achieve connections without increasing module height, effectively moving the interconnect path from the horizontal plane to the vertical dimension
2Reliability
If conventional interconnect methods are used, then connection is achieved, but interconnect area consumes large surface area on logic board
Solution Approach 1:
The patent merges the flex-PCB interconnect function with the module substrate itself. By integrating the flex-PCB directly into the module substrate and routing communication pathways through the resin body, the interconnect area is consolidated within the module footprint rather than consuming additional surface area on the logic board, thereby improving area utilization while maintaining connection reliability
3Area of stationary object
If flex-PCB is integrated into TMV module substrate, then compact design is achieved and space is freed, but manufacturing complexity increases
Solution Approach 1:
The patent incorporates the flex-PCB integration and TMV formation into the initial module assembly process. The flex-PCB is integrated into the substrate before the resin is applied, and TMVs are formed during the resin curing process, allowing the complex integration to be accomplished in advance during manufacturing rather than requiring additional post-assembly steps, thereby managing manufacturing complexity while achieving compact design
Data Source
AI summary
An integrated structure for interconnection of electrical components is provided. In one embodiment, the integrated structure includes a through mold via (TMV) module having a substrate and at least one component coupled to the substrate. A flexible printed circuit board (flex-PCB) is integrated with the substrate of the TMV module. A TMV is provided through a body of the module to allow the flex-PCB to couple with a logic board.