Embedded Electronic Component Carrying Structure for Compact Packaging

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Solution Overview

Problem

The existing flip chip packaging technique faces challenges such as uneven production quality, high production costs, limited electrical properties, and inflexibility due to complex and costly fabrication processes, as well as environmental concerns related to conventional soldering materials, which restrict the integration of passive components and increase package size.

Innovation Solution

A carrying structure comprising a first and second supporting board with holes and an adhesive layer that secures electronic components within cavities, allowing for improved electrical connectivity and reduced package size without additional adhesive injection, enabling better integration of passive and active components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional flip chip packaging technique is used with separate fabrication processes for circuit board and chip connection, then electrical connections can be established, but production quality becomes uneven and production cycle becomes long

Engineering Contradiction:

Improveproduction quality uniformityVSAvoidproduction cycle

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The patent merges the circuit board fabrication process and chip connection process into a single integrated process. The supporting board is fabricated with pre-formed cavities and adhesive layers, allowing electronic components to be directly mounted and fixed during the same fabrication run, eliminating the need for separate connection processes and achieving uniform production quality across all packages.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The supporting board is prepared in advance with pre-formed cavities and adhesive layers before component mounting. This preliminary preparation of the board structure with integrated mounting features enables subsequent chip placement and connection to occur during the same fabrication cycle, reducing overall production time and ensuring consistent quality.

Inventive Principle:

Principle #10Preliminary action

2Adaptability or versatility

If conventional FCBGA packaging structure is used, then high pin count and high frequency products can be supported, but packaging cost becomes high and technique faces limitations

Engineering Contradiction:

Improvesupport for high pin count and high frequency productsVSAvoidpackaging cost

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent replaces expensive conventional FCBGA packaging structures with a simpler, cost-effective supporting board design. The supporting board uses standard PCB fabrication techniques with integrated cavities and adhesive layers, eliminating the need for complex metal bumps, multiple wiring layers, and expensive encapsulation materials while maintaining the capability to support high pin count and high frequency applications.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent extracts and removes the complex and expensive elements from conventional FCBGA packaging, such as metal bumps, multiple encapsulation layers, and complex wiring structures. The essential function of electrical connection and mechanical support is achieved through a simplified supporting board with integrated cavities and adhesive layers, significantly reducing packaging cost.

Inventive Principle:

Principle #2Taking out (Extraction)

3Reliability

If vertical stacking structure is used to adhere semiconductor chip to topmost area of circuit board, then electrical connections are established, but overall height increases

Engineering Contradiction:

Improveelectrical connectionsVSAvoidoverall height

Core Design Contradiction:

ReliabilityVSLength of stationary object

Solution Approach 1:

The patent embeds the electronic component within a cavity of the supporting board, creating a nested structure where the component is housed inside the board thickness rather than extending above it. The adhesive layer fills the gap between the component and cavity walls, integrating the component into the board structure and maintaining a compact overall height while ensuring reliable electrical connections.

Inventive Principle:

Principle #7Nested doll (Nesting)

4Reliability

If semiconductor chip is sealed with gel for encapsulation, then protection is provided, but flexibility for other connections such as chip stacking or circuit board stacking is reduced

Engineering Contradiction:

Improvechip protectionVSAvoidflexibility for chip stacking or circuit board stacking

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent divides the supporting board into multiple levels or layers with separate cavities, allowing different electronic components to be mounted at different heights and positions. This segmented structure enables chip stacking and circuit board stacking configurations while providing individual protection for each component through its own cavity and adhesive layer, maintaining flexibility for various connection architectures.

Inventive Principle:

Principle #1Segmentation

5Adaptability or versatility

If passive components are mounted on surface of circuit board to increase functionality, then electrical functionalities are enhanced, but package size is forced to increase

Engineering Contradiction:

Improveelectrical functionalitiesVSAvoidpackage size

Core Design Contradiction:

Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The patent transitions from two-dimensional surface mounting of passive components to three-dimensional integration within the supporting board structure. Passive components are mounted in cavities at different levels and positions within the board thickness, utilizing the vertical dimension for component placement. This allows multiple passive components to be integrated without increasing the planar footprint, enhancing electrical functionality while maintaining compact package size.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution simplifies the fabrication process, enhances reliability, reduces package size, and improves flexibility and electrical functionality by securely embedding electronic components within the carrying structure, eliminating the need for direct chip-to-board soldering and allowing for better integration of passive components.

Implementation Method 1

a portion of the adhesive layer fills a gap between each electronic component and the first and second supporting boards, so as to fix each electronic component in the holes of the first and second supporting boards

Methodology Applied

Scientific EffectCapillary action: Capillary Action

Data Source

PatentEP1848029B1Carrying structure of electronic components

Publication Date: 2017.01.11 UNIMICRON TECH CORP

AI summary

A carrying structure of electronic components is proposed. The carrying structure includes at least one supporting board (25) with at least one cavity disposed thereon, at least one adhesive layer (27) formed on the supporting board (25), and at least one electronic component (23) having an active face and a non-active face located in the cavity. The gap between the cavity and the electronic component is filled with a portion of the adhesive layer (27), and thus the electronic component (23) is fixed in the cavity of the supporting board.