Electronic Module with Embedded Components and Insulating Layer
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Solution Overview
Problem
Existing electronic modules lack the ability to efficiently integrate multiple light-emitting components for flexible and cost-effective lighting or display applications while protecting components from mechanical and chemical damage.
Innovation Solution
A method involving an electrically conductive layer with light-emitting components affixed using a sticky insulating layer, embedded in transparent foil, and precision-contacted via laser-drilling and copper plating, with optional light-reflecting and protective layers for enhanced light emission and durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electronic components are directly mounted on a conductive layer, then electrical connection is achieved, but short-circuiting occurs due to lack of insulation
Solution Approach 1:
An electrically insulating layer with adhesive properties is introduced as an intermediary between the electronic component and the conductive layer. This mediator provides both electrical insulation to prevent short-circuiting and adhesive functionality to secure the component, resolving the contradiction between reliable electrical connection and short-circuit prevention.
2Ease of manufacture
If electronic components are exposed to the environment, then assembly is simple, but components are vulnerable to chemical and mechanical damage
Solution Approach 1:
The electronic component is embedded within a transparent foil, creating a nested structure where the foil encloses and protects the component. This nesting approach provides mechanical protection and chemical resistance while maintaining a relatively simple assembly process, resolving the contradiction between manufacturing ease and component protection.
3Adaptability or versatility
If multiple electronic components are integrated in a compact arrangement, then module functionality is enhanced, but manufacturing complexity increases
Solution Approach 1:
The module is segmented into distinct functional layers: conductive layer for electrical connections, insulating layer for mounting components, transparent foil for protection, and optional light-reflecting layers for optical enhancement. This segmentation allows multiple electronic components to be integrated in a compact arrangement while maintaining manageable manufacturing complexity through standardized layer assembly.
4Illumination intensity
If light-reflecting layers are added to enhance light emission, then lighting efficiency is improved, but device structure becomes more complex
Solution Approach 1:
The light-reflecting layer is merged with the existing transparent foil structure, combining the protective function of the foil with the optical enhancement function of the reflective layer. This merging approach enhances light emission efficiency while minimizing the increase in structural complexity by integrating multiple functions into a single layered component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the creation of flexible, cost-effective electronic modules for lighting or display purposes with improved light emission and protection from environmental influences, suitable for various applications including displays and cameras.
Implementation Method 1
affixing at least one electronic component on the electrically conductive layer by means of a sticky electrically insulating layer
Implementation Method 2
embedding the at least one electronic component in a transparent foil protects the electronic component from chemical and mechanical influences
Implementation Method 3
electrically contacting the at least one electronic component with the conductive layer
Implementation Method 4
the step of contacting the light-emitting component comprises a step of laser-drilling the conductive layer and the sticky electrically insulating layer
Implementation Method 5
a light-reflecting layer is applied to the electrically conductive layer. That means that light that is reflected to the electrically conductive layer for example by reflection on the boundary layer of the transparent foil will be reflected back again
Data Source
AI summary
An electronic module and method for the production of the electronic module in accordance with some embodiments of the invention are disclosed. The electronic module includes at least one electronic component affixed to a conductive layer by means of sticky electrically insulating layer, where the electronic component is embedded in a transparent foil. The electronic module is produces by providing an electrically conductive layer. At least one electronic component is affixed to the electrically conductive layer by means of a sticky electrically insulating layer and embedded in a transparent foil. The at least one electronic component is electronically contacted with the conductive layer.


