Electronic Component Mounting Position Correction with Solder Shift Limits
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Solution Overview
Problem
The existing electronic component mounting systems fail to uniformly correct mounting position shifts, leading to joint defects due to varying self-alignment effects based on component size, mass, and shape, as they uniformly apply position corrections regardless of the degree or mode of printing position shift.
Innovation Solution
An electronic component mounting system that includes a solder position detection mechanism, positional-shift amount calculation, and a mounting information storage system to define a performance mode with a limit value for allowable correction, allowing for tailored mounting position corrections based on calculated shifts, ensuring accurate alignment and joint quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If uniform mounting position correction is applied based on solder printing position shift, then mounting position alignment is improved, but joint quality deteriorates for large-sized components with excessive mass or positional shift
Solution Approach 1:
The patent changes the correction parameter from a uniform correction amount to a variable correction amount that depends on component characteristics (mass, size, shape). The correction amount is adjusted based on the self-alignment effect degree, which varies with component parameters. This resolves the contradiction by adapting the correction strategy to specific component properties rather than applying a one-size-fits-all approach.
Solution Approach 2:
The patent applies different correction strategies to different components based on their local characteristics. Each component receives a customized correction amount determined by its mass, size, and shape properties. This local quality approach ensures that components with high self-alignment effect receive appropriate correction while components with low self-alignment effect (large-sized components) receive limited correction to avoid joint defects.
2Manufacturing precision
If mounting position correction is applied based on solder printing position, then self-alignment effect is utilized, but asymmetrical components experience rotational forces that prevent accurate alignment
Solution Approach 1:
The patent modifies the correction approach by considering component shape parameters in addition to position shift. For asymmetrical components, the correction amount is adjusted to account for the self-alignment effect limitations caused by asymmetrical geometry. This prevents excessive correction that would create rotational forces, thereby maintaining both alignment accuracy and process reliability.
3Manufacturing precision
If excessive correction amount is applied to large-sized components, then mounting position is adjusted, but the self-alignment effect becomes insufficient and components do not move to normal mounting position
Solution Approach 1:
The patent establishes a relationship between component mass/size parameters and the optimal correction amount. For large-sized components with high mass, the correction amount is reduced to a level that does not exceed the effective range of the self-alignment effect. This ensures that the molten solder can still effectively pull the component to the correct position without creating excessive stress or deformation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables appropriate mounting position corrections considering the solder printing position, effectively improving joint quality by minimizing defects and optimizing the self-alignment effect for diverse electronic components.
Implementation Method 1
the electronic component does not accurately move to the normal mounting position through a suction force due to surface tension
Data Source
AI summary
In mounting position correction of detecting a position of printed solder, calculating a positional-shift amount between a position of an electrode and the position of the printed solder, and correcting a mounting position based on the calculated positional-shift amount, when a correction amount based on the calculated positional-shift amount exceeds a limit value which indicates an upper limit of the correction amount which is defined and allowed in mounting information, the electronic component is mounted on the mounting position which is corrected by considering the limit value as the correction amount. Accordingly, it is possible to appropriately employ mounting position correction by considering a solder printing position as a reference in accordance with the degree of printing position shift, and to obtain an expected joint quality improvement effect.