Electronic Circuit Module With Through-Conductor Shield Connection
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Solution Overview
Problem
Conventional electronic circuit modules face challenges in reliably connecting a metal shield on the side surface to a power supply pattern, leading to increased manufacturing costs and insufficient connection reliability, while also struggling to effectively shield electromagnetic noise.
Innovation Solution
The implementation of through conductors that penetrate the molding resin to connect the metal shield on the upper surface to the power supply pattern, eliminating the need for side surface connections and enhancing connection reliability, with the option to expose through conductors on the side surface for additional shielding and sharing through conductors between modules to reduce size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the metal shield is formed on the side surface and connected to the power supply pattern, then electromagnetic shielding is achieved, but manufacturing complexity increases and connection reliability becomes insufficient
Solution Approach 1:
The patent transitions from connecting the metal shield on the side surface to connecting it through the upper surface by forming through-conductors that penetrate the molding resin vertically. This dimensional change simplifies the manufacturing process by eliminating side surface connections while maintaining electromagnetic shielding effectiveness.
Solution Approach 2:
The patent extracts the connection function from the side surface to the upper surface by introducing through-conductors that pass through the molding resin. This separates the shielding function (metal shield on upper surface) from the connection function (through-conductors penetrating resin), simplifying manufacturing and improving reliability.
2Object-affected harmful factors
If the metal shield is formed on the side surface and connected to the power supply pattern, then electromagnetic shielding is achieved, but manufacturing cost increases
Solution Approach 1:
By moving the connection point from the side surface to the upper surface through vertical through-conductors, the patent enables simpler manufacturing processes that reduce costs while maintaining shielding effectiveness.
Solution Approach 2:
The through-conductors serve multiple functions: they provide electrical connection between the metal shield and power supply pattern, act as grounding paths for electromagnetic shielding, and can be integrated into the molding process, reducing overall manufacturing complexity and cost.
3Reliability
If the metal shield on the side surface is connected to the power supply pattern by covering thin ground wiring, then connection is achieved, but connection reliability is insufficient
Solution Approach 1:
The patent extracts the connection path from the thin ground wiring on the side surface to robust through-conductors penetrating the molding resin. This provides a more reliable mechanical and electrical connection that is less susceptible to manufacturing variations and environmental stress.
Solution Approach 2:
By transitioning from two-dimensional surface wiring to three-dimensional through-conductors, the patent creates a more reliable connection that penetrates the molding resin and provides multiple contact points, significantly improving connection reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies manufacturing, enhances connection reliability, and effectively shields electromagnetic noise, while allowing for reduced module size and improved moisture release through strategic metal shield openings.
Implementation Method 1
a through conductor formed so as to penetrate through the molding resin and connect the metal shield to the power supply pattern
Implementation Method 2
it is possible to shield electromagnetic noise emitted from the electronic component and external noise entering the electronic component
Data Source
AI summary
Disclosed herein is an electronic circuit module that includes a substrate having a power supply pattern, an electronic component mounted on a front surface of the substrate, a molding resin that covers the front surface of the substrate so as to embed the electronic component therein, a metal shield covering the molding resin, and a through conductor formed so as to penetrate through the molding resin to connect the metal shield to the power supply pattern.