Single Glass Substrate Antenna Package for Millimeter-Wave Integration
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Solution Overview
Problem
Current millimeter-wave antenna packages are costly and complex due to the use of two glass substrate layers, which require drilling through-silicon vias and can lead to delamination and thermal expansion mismatches, making them difficult to manufacture and unreliable.
Innovation Solution
A glass-based antenna array package using a single glass substrate layer with antennas attached to one side and a photoimageable dielectric layer encapsulating the semiconductor device on the other side, eliminating the need for a second glass substrate layer and through-silicon vias, and allowing for low-cost, heterogeneous integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If two glass substrate layers are used in millimeter-wave antenna packages, then structural support and component mounting are achieved, but manufacturing complexity and cost increase due to drilling through-silicon vias and potential delamination
Solution Approach 1:
The patent removes the second glass substrate layer from the traditional two-layer structure, extracting only the essential encapsulation function. The photoimageable dielectric layer is retained to provide necessary protection and electrical isolation, while eliminating the complex via drilling and bonding processes associated with the second glass layer, thus reducing manufacturing complexity while maintaining reliability
Solution Approach 2:
The patent introduces a photoimageable dielectric layer as an intermediary material between the glass substrate and the semiconductor device. This layer provides the necessary encapsulation, electrical isolation, and mechanical support that would otherwise require the second glass substrate, thereby simplifying the overall structure and manufacturing process while maintaining the required reliability
2Adaptability or versatility
If two glass substrate layers are used with through-silicon vias, then component integration is achieved, but thermal expansion mismatches and delamination occur
Solution Approach 1:
The patent applies different material properties to different regions of the package structure. The photoimageable dielectric layer is specifically designed with thermal expansion characteristics that match the glass substrate, creating local thermal compatibility at the interface. This localized material selection prevents thermal expansion mismatches and delamination while still enabling effective component integration
Solution Approach 2:
The patent uses a composite structure combining glass substrate with photoimageable dielectric layer, where each material is selected for its specific properties. The dielectric layer acts as a buffer with matched thermal expansion characteristics, creating a composite structure that maintains thermal stability while enabling heterogeneous component integration
3Strength
If multiple glass substrate layers are used, then structural integrity is improved, but manufacturing cost and process difficulty increase
Solution Approach 1:
The patent extracts only the essential structural and protective functions from the second glass substrate layer, retaining them through the photoimageable dielectric layer. This eliminates the need for complex multi-layer glass bonding and via drilling processes, significantly improving manufacturing ease while maintaining sufficient structural integrity for the antenna package
Solution Approach 2:
The patent replaces expensive, difficult-to-manufacture second glass substrate with a cheaper, easier-to-process photoimageable dielectric layer. This material can be applied through standard photolithography and curing processes, making the manufacturing process more accessible and cost-effective while achieving the necessary structural and protective functions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces manufacturing costs and complexity, enhances reliability by avoiding thermal expansion mismatches and delamination issues, and enables efficient signal transmission with reduced signal line loss and improved thermal compliance.
Implementation Method 1
a photoimageable dielectric layer adhered to the second side of the glass substrate layer and encapsulating the at least one semiconductor device
Data Source
AI summary
The disclosure relates to a glass-based antenna array package. In an aspect, such a glass-based antenna array package includes a single glass substrate layer, one or more antennas attached to a first side of the glass substrate layer, at least one semiconductor device attached to a second side of the glass substrate layer, and a first photoimageable dielectric layer adhered to the second side of the glass substrate layer and encapsulating the at least one semiconductor device. A method of manufacturing the same is also disclosed.