Copper Via Substrate for Electronic Device Thermal and Electrical Optimization

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Solution Overview

Problem

Existing electronic devices made from ceramics are costly, prone to breakage, and have high ON-state resistance due to long aluminum bond wires, with thermal expansion coefficient mismatches between chips and contacts reducing reliability.

Innovation Solution

The use of a copper-based substrate with short copper vias instead of aluminum bond wires, integrated electrical insulation, and a symmetrical layer structure to reduce chip size and thermal expansion differences, allowing for direct integration into a printed circuit board.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If ceramics are used as substrate material, then electrical insulation is achieved, but the device becomes costly and susceptible to breakage

Engineering Contradiction:

Improvebreakage resistanceVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent changes the substrate material from ceramic to organic insulation material, fundamentally altering the material parameter to achieve both cost reduction and improved breakage resistance while maintaining electrical insulation properties

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent replaces expensive ceramic substrates with cheaper organic insulation materials, making the device more cost-effective while maintaining sufficient reliability for the application

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

2Reliability

If long aluminum bond wires are used, then electrical connection is established, but ON-state resistance increases

Engineering Contradiction:

Improveelectrical connection stabilityVSAvoidON-state resistance

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

The patent removes the aluminum bond wires entirely and replaces them with copper vias, extracting the harmful long connection path and replacing it with a short, low-resistance alternative

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent replaces the mechanical bonding process (wire bonding) with an electrical conduction path through copper vias, substituting a mechanical connection system with a more efficient electrical conduction system

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Ease of manufacture

If asymmetric layer structure is used, then manufacturing is simplified, but planarity and thermal expansion matching deteriorate

Engineering Contradiction:

Improvelayer structure fabricationVSAvoidthermal expansion coefficient matching

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent employs a symmetric layer structure where identical layers are placed on both sides of the substrate, creating thermal expansion balance and improving planarity while maintaining manufacturability through the symmetric design

Inventive Principle:

Principle #4Asymmetry

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach results in a cost-effective, reliable electronic device with reduced ON-state resistance, increased planarity, and improved thermal management, making it more resistant to breakage and suitable for high-performance applications.

Implementation Method 1

a contact composed of a copper layer and copper vias extending through the insulating layers to the electronic component

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

at least one first insulating layer, at least one first electronic component, at least one second insulating layer, and a contact composed of a copper layer and copper vias

Methodology Applied

Scientific EffectElectrical insulation: Dielectric

Data Source

PatentUS8811019B2Electronic device, method for producing the same, and printed circuit board comprising electronic device

Publication Date: 2014.08.19 SCHWEIZER ELECTRONIC AG(DE)

AI summary

An electronic device comprising an electrically conductive core layer with a first layer composed of electrically conductive material, the first layer being applied on both sides and with at least one electronic component arranged in a cutout of the first layer, wherein the first layer is covered in each case with an electrically insulating, thermally conductive layer and a further layer composed of electrically conductive material is provided in each case on the thermally conductive layer, the further layer being coated in each case with a covering layer composed of electrically conductive material, and furthermore having plated-through boles composed of the material of the covering layer, which extend through the electrically insulating, thermally conductive layer covering the electronic component and the further layer composed of electrically and thermally conductive material for the purpose of making contact with the electronic component.