Component-Embedded Module With Segmented Substrate And Via Conductors
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Solution Overview
Problem
The high cost and reduced yield associated with manufacturing component-embedded modules with high dimensional accuracy for both integrated circuit and passive components, particularly due to the difficulty in accurately forming lands and wiring lines on substrates for integrated circuit elements with many terminals, and the challenge of inspecting flip-chip-mounted integrated circuit elements.
Innovation Solution
A component-embedded module design that includes a module substrate with a wiring pattern on both surfaces and via conductors or through holes connecting the upper and lower surfaces, allowing a sub-module with high wiring accuracy to be mounted on a substrate with lower accuracy, enabling direct coupling of terminal electrodes and reducing the need for high-cost substrates and improving yield through pre-inspection of the mounting state.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high dimensional accuracy is required for both integrated circuit elements and passive components on the same module substrate, then the reliability of the integrated circuit element mounting is improved, but the manufacturing cost increases due to the need for high-precision substrates
Solution Approach 1:
The invention divides the module substrate into two distinct parts: a first substrate for mounting passive components with lower precision requirements, and a second substrate for mounting integrated circuit elements with high precision requirements. This segmentation allows each substrate to be manufactured with appropriate precision levels, reducing overall manufacturing cost while maintaining reliability for critical components.
Solution Approach 2:
The invention applies different quality standards to different regions of the module. The second substrate area designated for integrated circuit element mounting is manufactured with high dimensional accuracy, while the first substrate area for passive components uses lower precision standards. This local differentiation of quality requirements optimizes the balance between reliability and manufacturing cost.
2Productivity
If flip-chip mounting is used for integrated circuit elements with narrow pitch terminals, then the mounting density is improved, but the inspection difficulty increases making it hard to detect coupling failures
Solution Approach 1:
The invention performs preliminary mounting of integrated circuit elements on the second substrate before final assembly into the complete module. This preliminary action allows inspection and detection of coupling failures to be conducted at an intermediate stage when the integrated circuit elements are still accessible, rather than after final encapsulation. Defects can be identified and corrected before the insulating resin layer is formed, improving yield.
3Device complexity
If a single substrate is used for all circuit components, then the device structure is simplified, but the wiring accuracy requirement increases leading to higher costs
Solution Approach 1:
The invention segments the single substrate into a first substrate and a second substrate with different precision characteristics. The second substrate is specifically designed with high wiring accuracy for integrated circuit elements, while the first substrate has standard precision for passive components. This segmentation maintains relatively simple overall device structure while avoiding the need for a single high-precision substrate.
Data Source
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Figure 4(a)~4(h)
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AI summary
[Problem] To provide a reliable component-embedded module that allows a reduction in cost and an increase in yield. [Solving Means] A component-embedded module A includes a module substrate 1 having wiring electrodes 2 on the upper surface thereof, first circuit components 7 mounted on the wiring electrodes 2, a sub-module 10 disposed on an area on which no wiring electrodes 2 are formed, and an insulating resin layer 20 formed on the entire upper surface of the module substrate in such a manner that the insulating resin layer 20 covers at least parts of the first circuit components and sub-module. The second circuit components 15 including an integrated circuit element are mounted on the sub-module 10 or embedded therein. Via conductors 3 are formed through the module substrate 1 from the lower surface thereof and are directly coupled to terminal electrodes 14 on the lower surface of the sub-module 10. By using a substrate having a wiring accuracy higher than that of the module substrate 1, a reliable component-embedded module is obtained.