Multi-Layered Substrate Fabrication via Double-Sided Lamination
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Solution Overview
Problem
Current BOC packaging methods for high-frequency applications result in wasteful processing of single-sided substrates, where the dummy side undergoes unnecessary steps and materials are wasted, leading to inefficiencies in raw material usage and processing efforts.
Innovation Solution
A fabrication method for a multi-layered substrate that employs a double-sided lamination structure with a core and stacked laminate structures, allowing for single-sided or double-sided substrates to be created by patterning and separating metal layers, and optionally forming plated-through holes and surface plating, which can be further processed to enhance electrical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If single-sided substrates are fabricated using traditional methods with dummy sides, then the substrate structure is simple, but material waste increases and productivity decreases
Solution Approach 1:
The patent combines the fabrication of two single-sided substrates into a single double-sided substrate structure. The first and second laminate structures are laminated to opposite sides of a core structure, allowing both substrates to be processed simultaneously through the same manufacturing steps, thereby doubling productivity and eliminating material waste associated with dummy sides.
Solution Approach 2:
The core structure serves multiple functions: it acts as a temporary carrier during fabrication and provides structural support for both laminate structures. This multi-functional design eliminates the need for separate dummy substrates and enables efficient utilization of raw materials while maintaining compatibility with existing manufacturing processes.
2Manufacturing precision
If dummy sides are processed through complete fabrication steps, then manufacturing precision is maintained, but loss of time and energy increase
Solution Approach 1:
The patent merges the fabrication processes for what would traditionally be two separate single-sided substrates into a single integrated double-sided substrate. Both laminate structures undergo identical processing steps (lamination, drilling, plating, patterning, masking) simultaneously, maintaining manufacturing precision while halving the total processing time and energy consumption.
3Reliability
If plated-through holes are reinforced with double plating layers, then electrical performance improves, but manufacturing complexity increases
Solution Approach 1:
The patent combines the plating process for both laminate structures into a single operation. By performing surface plating on the double-sided substrate simultaneously, both plated-through holes receive reinforced double plating layers in one step, improving electrical performance without significantly increasing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method doubles productivity by utilizing both sides of the substrate effectively, reducing material waste and enhancing electrical performance through reinforced plated-through holes, while maintaining compatibility with existing manufacturing processes.
Implementation Method 1
forming a plurality of plated-through holes in the double-sided lamination structure by drilling and plating
Implementation Method 2
performing a surface plating process to form a Ni/Au layer located on the metal layer that is not covered by the mask layer
Data Source
AI summary
The present invention directs to fabrication methods of single-sided or double-sided multi-layered substrate by providing a lamination structure having at least a core structure and first and second laminate structures stacked over both surfaces of the core structure. The core structure functions as the temporary carrier for carrying the first and second laminate structures through the double-sided processing procedures. By way of the fabrication methods, the production yield can be greatly improved without increasing the production costs.