3D Circuit Board Structure for Multi-Height Electrical Connections
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Solution Overview
Problem
Conventional circuit boards with rigid substrates require additional wires or flexible circuit boards for connections between components at different heights, increasing complexity and manufacturing costs.
Innovation Solution
A circuit board structure with a flexible core board, conductive layers, solder mask layers, and protective layers, allowing for integrated three-dimensional electrical connections without cables or flexible boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If rigid substrates are used for circuit boards, then structural stability is improved, but additional wires or flexible circuit boards are required for connections at different heights, increasing device complexity
Solution Approach 1:
The patent merges the rigid substrate with flexible circuit board functionalities by integrating a flexible circuit board layer onto the rigid substrate. This combination allows the circuit board to maintain structural stability from the rigid substrate while gaining the flexibility needed for three-dimensional connections at different heights, thereby eliminating the need for separate wires or flexible circuit boards and reducing overall device complexity.
Solution Approach 2:
The patent introduces vertical stacking of multiple circuit board layers at different heights, transforming the traditional two-dimensional circuit board layout into a three-dimensional structure. This dimensional change enables direct electrical connections between components at different levels through vias and conductive structures integrated within the stacked layers, eliminating the need for external wires and reducing device complexity.
2Reliability
If additional wires or flexible circuit boards are used for connections, then electrical connectivity between different heights is achieved, but manufacturing and management costs increase
Solution Approach 1:
The patent combines multiple circuit board layers into a single integrated structure, merging the functions of rigid substrates and flexible circuit boards. This integration eliminates the need for separate manufacturing processes for wires and flexible circuit boards, reducing the variety of components that need to be managed and lowering both manufacturing and management costs while maintaining reliable electrical connectivity.
Solution Approach 2:
The integrated circuit board structure serves multiple functions simultaneously: it provides structural support, enables electrical connections at different heights, and offers flexible routing capabilities. This multi-functionality reduces the need for separate components and simplifies the overall manufacturing process, thereby reducing costs.
3Adaptability or versatility
If a variety of electronic components are used, then functional requirements are met, but manufacturing and management complexity and cost increase
Solution Approach 1:
The patent creates a universal circuit board structure that can accommodate various electronic components and routing requirements through its integrated design. The flexible circuit board layer can be configured to meet different functional requirements, reducing the need for specialized components and simplifying component management while maintaining adaptability.
Solution Approach 2:
The circuit board is segmented into multiple functional layers with distinct roles: rigid substrate for structural support, flexible circuit board for routing flexibility, and integrated connection structures for electrical connectivity. This segmentation allows each layer to be optimized independently while working together to meet diverse functional requirements without increasing overall component variety.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Simplifies internal configurations and significantly reduces manufacturing and management costs by enabling integrated three-dimensional electrical connections.
Implementation Method 1
forming a plurality of electrically-conductive members on the electrical connection portions respectively and exposed from the opening portions respectively through a physical/chemical deposition process
Data Source
AI summary
A circuit board structure includes a flexible core board, a first circuit layer, a first solder mask layer, a first protective layer, a rigid plate and a plurality of electrically-conductive members. The flexible core board includes a first surface and a second surface. The first circuit layer is formed on the first surface, and has a plurality of electrical connection portions. The first solder mask layer is coated on the first circuit layer and the first surface. The first solder mask layer has a plurality of opening portions aligned with the electrical connection portions. The first protective layer is disposed on the first solder resist layer and has a flat surface. The rigid plate is disposed on the second surface and corresponds to the opening portions. The electrically-conductive members are respectively formed on the electrical connection portion and exposed from the opening portion.