Circuit Bendability/Stretchability TRIZ Cases
- Foldable Light Strip Structure for On-Site Beam Shaping
Segmented domains, fold lines, and adhesive layers let light strips ship flat, install easily, and adjust beam direction with added rigidity.
- Thermoplastic Housing Encapsulation for Smart Textile Electrical Contacts
Thermocompression with a conductive thermoplastic housing bonds and seals textile-mounted electronics without damaging heat-sensitive fabric.
- Flexible PCB Protrusion Layout for Precise Display Pad Bonding
Segmented flexible PCB protrusions with alignment marks improve display pad bonding precision despite process error and thermal expansion.
- Rigid-Flex PCB Recess Structure for Fold-Boundary Stress Relief
A recessed rigid insulating layer at the flex-rigid boundary lowers bending stress and crack risk without sacrificing PCB component area.
- Flexible Printed Wiring Exposure Layout to Prevent Step Formation
Tapered photomask tips and overlapping exposure regions keep flexible wiring continuous, avoiding steps and stress concentration during bending.
- Flexible Sensor Arrays on Soft Catheters for Cardiac Mapping
Flexible PCB sensor arrays laminated on soft actuators improve heart-chamber conformability and near-field mapping accuracy.
- Multilayer Substrate Bend Structure for Signal Isolation Stability
A protrusion in the bent multilayer substrate reinforces bend rigidity while stabilizing conductor spacing to reduce noise, signal loss, and wiring fatigue.
- Stretchable Wiring Via Structure for Reliable Electrode Alignment
Segmented via regions in an interlayer sheet keep stretchable wiring electrodes aligned and connected during stretching and contraction.
- PCB Contact Pad Groove Layout for Thermal Stress Relief
A recessed groove around the PCB contact pad lets soldered sections flex under thermal expansion, reducing crack risk and extending service life.
- Image Sensor Circuit Board Layout for Heat Dissipation and Mobility
Separated insulating regions and bent connection patterns improve image sensor heat dissipation, mobility, and electrical reliability.
- Smart Card PCB Pre-Package for Non-Planar Component Protection
A layered smart card PCB pre-package levels non-planar components and resists lamination deformation for robust ISO-compliant insertion.
- Stretchable Printed Circuit With Dynamic Adhesion and Thin Elastomer Wrap
Dynamic adhesion reduction holds serpentine circuits during cutting, then strips cleanly to improve yield and reduce printed circuit thickness.
- Multilayer Liquid-Metal Interconnects for Deformable Circuit Reliability
Liquid-metal traces and vias in multilayer flexible circuits maintain conductivity under strain and temperature while reducing stiffness and fabrication time.
- Adhesive Circuit Patterning With Hot-Melt Film Joint Reinforcement
A hot-melt adhesive film protects printed traces, reinforces SMD bonded joints, and adds waterproof attachment in one curing step.
- Thermal Adhesive Circuit Patterning for Reliable Flexible Interconnects
A thermal adhesive film reinforces printed traces and SMD joints in one lamination step, improving flexible interconnect reliability and water resistance.
- Foldable Display Support Layers With Uneven Thickness at the Hinge
Separated support layers with different thicknesses and materials reinforce a foldable display while preserving hinge flexibility and function.