Adhesive Circuit Patterning With Hot-Melt Film Joint Reinforcement
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Solution Overview
Problem
Existing methods for protecting printed circuit traces and adhesive bonded joints in flexible electronics are costly, have limited supplier chains, are not suitable for high-density circuitry or miniaturization, require additional waterproofing, and suffer from low interconnect reliability and printing inconsistencies.
Innovation Solution
A method involving the use of thermoplastic polyurethane hot melt films to reinforce and protect printed circuit traces and adhesive bonded joints through a single heat curing process, where a circuit pattern is printed on the film, surface mounted devices are attached, and the assembly is placed on a flexible substrate with a second film to reinforce and protect the joints.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional encapsulation processes and lamination processes are used to protect circuit traces and adhesive bonded joints, then protection and reinforcement are achieved, but multiple different techniques are needed and the process becomes complex
Solution Approach 1:
The patent combines multiple protective functions (encapsulation, lamination, reinforcement of adhesive bonded joints, and waterproofing) into a single hot melt adhesive film that performs all these functions simultaneously through one application process, eliminating the need for multiple separate techniques
Solution Approach 2:
The hot melt adhesive film serves multiple functions: it acts as an encapsulant for circuit traces, a laminate for structural support, a reinforcement layer for adhesive bonded joints, and a waterproofing barrier, making it a universal protective solution
2Ease of manufacture
If circuit embroidery, flocking, or direct conductive ink screen printing is used, then circuit patterns can be created, but high raw material cost and high capital expenditure are incurred
Solution Approach 1:
The patent uses a cost-effective hot melt adhesive film with integrated conductive ink instead of expensive conductive yarns or sub-nanometal particle materials, significantly reducing raw material costs while maintaining circuit functionality
Solution Approach 2:
The invention uses a composite structure where conductive ink is deposited on hot melt adhesive film, combining the adhesive properties of the film with the conductive properties of the ink to create a functional circuit carrier
3Ease of manufacture
If circuit embroidery, flocking, or direct conductive ink screen printing is used, then circuit patterns can be created, but additional waterproofing processes are required
Solution Approach 1:
The hot melt adhesive film integrates waterproofing functionality into its base material structure, so the circuit pattern creation and waterproofing occur in a single combined process without requiring separate waterproofing steps
4Reliability
If conventional separate processes are used for protecting circuit traces and adhesive bonded joints, then protection is achieved, but the process time and production efficiency are reduced
Solution Approach 1:
The patent applies a single hot melt adhesive film that simultaneously protects circuit traces, reinforces adhesive bonded joints, and provides waterproofing in one operation, dramatically improving production efficiency compared to multiple separate processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method provides robust, environmentally-proof devices with improved interconnect reliability, suitable for high-density circuitry and miniaturization, and eliminates the need for additional waterproofing processes.
Implementation Method 1
The thermal adhesive film is melted on the assembled printed circuit and the stretchable substrate to protect and reinforce joint bonds and the circuit pattern of the assembled printed circuit pattern and attach the assembled printed circuit to the stretchable fabric in one melting or curing step
Implementation Method 2
The thermal adhesive film is melted on the assembled printed circuit and the stretchable substrate
Data Source
AI summary
Disclosed are processes and materials for adhesive circuit patterning which strengthen and protect printed circuit traces and adhesive bonded joints of surface mounted devices in flexible or stretchable electronics in a single process. A method for adhesive circuit pattering include deposing a circuit pattern directly on a single thermal adhesive film, placing one or more surface mounted devices on a cured deposed circuit of the deposed circuit pattern, curing the one or more surface mounted devices and the cured deposed circuit together to form an assembled deposed circuit, placing the assembled deposed circuit on a stretchable substrate, and melting the single thermal adhesive film directly onto the assembled deposed circuit and the stretchable substrate to reinforce joint bonds of the assembled deposed circuit and to attach the assembled deposed circuit to the stretchable substrate.