Image Sensor Circuit Board Layout for Heat Dissipation and Mobility
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Solution Overview
Problem
Camera modules face issues with inefficient heat dissipation and increased surface temperature due to the separation of the image sensor and sensor substrate, leading to reliability problems as the size of the image sensor increases, especially with higher resolution requirements.
Innovation Solution
A circuit board design with insulating regions and pattern portions, including a connection portion with a bent structure and a heat dissipation portion, enhances heat dissipation and mobility, while improving adhesion and electrical reliability through a plating layer and surface treatment layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the image sensor and sensor substrate are separated due to the actuator structure, then the actuator can drive the sensor, but the heat generated from the image sensor and sensor substrate cannot be transferred to the outside, causing continuous increase in surface temperature
Solution Approach 1:
The substrate is divided into a first substrate (sensor substrate) and a second substrate (interposer), with the image sensor mounted on the first substrate and the actuator on the second substrate. This segmentation allows the sensor to be driven while creating separate heat dissipation paths through the individual substrates to their respective heat sinks.
2Device complexity
If the contact region between the sensor shift substrate and the image sensor is made small, then the structure is more compact, but the heat dissipation efficiency is reduced
Solution Approach 1:
Heat dissipation is achieved not only through the contact region between substrates but also through separate heat sinks attached to the bottom surfaces of both substrates. This adds a vertical dimension (z-axis) to heat dissipation, allowing effective heat removal even when the contact area is small.
3Measurement precision
If the size of the image sensor is increased to meet higher resolution requirements, then the resolution is improved, but the amount of heat generated increases, leading to reliability problems
Solution Approach 1:
The interposer substrate acts as an intermediary between the sensor substrate and the main circuit board, providing additional heat dissipation pathways. Heat generated by the high-resolution sensor can be transferred through the interposer to its dedicated heat sink, preventing heat accumulation and maintaining sensor reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves heat dissipation, mobility, and electrical reliability, ensuring accurate movement and enhanced product performance by reducing heat-related issues and maintaining electrical connectivity.
Implementation Method 1
improve the adhesion between the insulating portion and the pattern portion
Implementation Method 2
improve the adhesion between the insulating portion and the pattern portion
Implementation Method 3
improve the heat dissipation characteristics of the image sensor
Implementation Method 4
heat generated from the image sensor and the sensor substrate cannot be transferred to the outside
Data Source
AI summary
A circuit board includes an insulating portion and a pattern portion on the insulating portion. The insulating portion includes a first insulating region and a second insulating region outside the first insulating region and spaced apart from the first insulating region with a separation region therebetween. The pattern portion includes a first pattern portion for signal transmission and a second pattern portion including a dummy pattern separated from the first pattern portion. The first pattern portion includes a first terminal portion on the first insulating region, a second terminal portion on the second insulating region, and a connection portion on the separation region and connecting between the first terminal portion and the second terminal portion. The second pattern portion includes a second-first pattern portion on the first insulating region and a second-second pattern portion on the second insulating region and separated from the second-first pattern portion.