Multilayer Liquid-Metal Interconnects for Deformable Circuit Reliability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional flexible and stretchable electronics face challenges with unreliable and elastically deformable interconnections, thick and stiff construction, and time-consuming fabrication methods, limiting their application in flexible circuits.
Innovation Solution
The development of multilayer deformable liquid-metal circuits with deformable interconnects that utilize a substrate with dielectric layers and liquid metal traces, vias, and interconnects to connect ICs and electronic parts, leveraging FPC vendor fabrication capabilities for rapid production with reduced bending stiffness and enhanced trace density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional flexible electronics are used, then flexibility is provided, but the interconnections are unreliable and elastically deformable
Solution Approach 1:
The patent changes the material parameter from conventional solid conductors to liquid metal, which maintains electrical conductivity while adapting to deformation. The liquid metal interconnects can flow and reconfigure under strain, maintaining reliable electrical connections during elastic deformation of the flexible substrate.
Solution Approach 2:
The patent uses composite structures combining liquid metal with encapsulating materials and flexible substrates. The liquid metal is enclosed within a flexible capsule or channel structure that allows deformation while maintaining structural integrity and electrical conductivity, creating a composite interconnection system.
2Productivity
If conventional fabrication methods are used, then electronic circuits can be manufactured, but the process is time-consuming
Solution Approach 1:
The patent employs preliminary patterning of the flexible substrate and pre-positioning of liquid metal reservoirs before final assembly. Channels and contact pads are pre-formed on the substrate, allowing rapid placement of liquid metal interconnects without time-consuming step-by-step conductor formation.
Solution Approach 2:
The patent replaces conventional mechanical soldering and wire bonding processes with liquid metal transfer methods. Liquid metal can be rapidly deposited or transferred to contact points using pressure, capillary action, or injection, eliminating time-consuming mechanical joining operations.
3Strength
If conventional flexible electronics are used, then basic flexibility is achieved, but the circuits are relatively thick and stiff
Solution Approach 1:
The patent uses thin flexible substrate films and encapsulating layers to contain the liquid metal interconnects. The overall structure is designed as a thin-film composite with the liquid metal confined to narrow channels, reducing total thickness while maintaining flexibility through the thin-film construction.
Solution Approach 2:
The patent segments the conductive path into discrete liquid metal segments within separate channels, each independently enclosed. This segmentation allows the interconnects to deform locally without affecting the entire circuit, reducing overall stiffness while maintaining electrical continuity through the segmented liquid metal elements.
Data Source
AI summary
A method of the subject technology includes obtaining a first electronic component comprising a first plurality of contacts and/or pins, obtaining an electronic part comprising a first plurality of circuit components corresponding to the first plurality of contacts and/or pins and forming a first layer over the first plurality of circuit components. The method further includes forming a first plurality of liquid metal (LM) interconnects in the first layer at locations corresponding to the first plurality of circuit components.