Stretchable Printed Circuit With Dynamic Adhesion and Thin Elastomer Wrap
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Solution Overview
Problem
Existing methods for manufacturing stretchable conductor circuits face challenges in mass production yield due to high binding forces required for carrier film separation and complex mold designs, resulting in large circuit thickness that hinders thin and light design.
Innovation Solution
A manufacturing method involving a flexible circuit board with adhesion-reducing carrier films and elastomer composite films, allowing for contour cutting and controlled adhesive forces to facilitate serpentine circuit formation, supporting mass production and reducing circuit thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the binding force between the carrier film and the serpentine circuit is increased to prevent separation during scrap discharge, then the reliability of the circuit is improved, but the ease of stripping the carrier film after combination deteriorates
Solution Approach 1:
The patent applies a dynamic adhesion-reducing treatment that changes the binding force of the carrier film from strong to weak at different stages. Initially, the carrier film has strong adhesion to hold the serpentine circuit during scrap discharge. After the elastomer is combined with the serpentine circuit, an adhesion-reducing operation is performed to weaken the carrier film's binding force, enabling easy stripping. This dynamic adjustment resolves the contradiction between maintaining reliability during manufacturing and enabling ease of manufacture during stripping.
2Adaptability or versatility
If the serpentine circuit is wrapped in a high-elasticity polymer using casting method, then the stretchability of the circuit is improved, but the device complexity and thickness increase
Solution Approach 1:
The patent uses a thin elastomer composite film to wrap the serpentine circuit instead of traditional thick casting methods. This thin film approach maintains the stretchability and flexibility of the circuit while significantly reducing the overall thickness and eliminating the need for complex mold designs. The elastomer composite film provides the necessary elasticity and protection without adding excessive complexity or bulk to the device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances mass production yield and achieves thin, stretchable, and flexible printed circuits with reduced thickness, enabling miniaturization and improved design flexibility.
Implementation Method 1
the adhesion-reducing carrier film is any one of a UV adhesion-reducing film and a thermal adhesion-reducing film
Implementation Method 2
the adhesion-reducing carrier film is any one of a UV adhesion-reducing film and a thermal adhesion-reducing film
Data Source
AI summary
Disclosed are a thin, stretchable and flexible printed circuit and a manufacturing method therefor. The manufacturing method comprise: attaching an adhesion-reducing carrier film to a first side of a flexible circuit board provided with a circuit layer and two protective films, wherein the adhesion-reducing carrier film has a large first preset adhesive force; and attaching a first elastomer composite film, and then performing an adhesion-reducing operation on the adhesion-reducing carrier film to allow the adhesion-reducing carrier film to have a small second preset adhesive force. The elastomer composite film is formed by two polymer films with different melting points. The invention can increase the product yield in mass production based on the adhesion-reducing carrier film and can wrap a serpentine circuit by means of the elasticity of a composite structure of the polymer films to realize thin and light design and miniaturization.