3D Circuit Board Recessed Mounting for Endoscope Downsizing
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Solution Overview
Problem
Conventional image pickup units in endoscopes face challenges in downsizing while maintaining performance and functionality, as the expansion of electronic components and signal transmission cables leads to increased size and complexity, which existing three-dimensional circuit board configurations cannot adequately address.
Innovation Solution
The image pickup unit incorporates a three-dimensional circuit board with recessed portions for component mounting, allowing for increased surface area utilization and secure housing of electronic components and cables within the projection plane, preventing external enlargement and enabling enhanced functionality without increasing the apparatus's size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electronic components and signal transmission cables are expanded to enhance functionality, then the functionality of the image pickup unit is improved, but the size and complexity of the apparatus increases
Solution Approach 1:
The patent applies a three-dimensional circuit board configuration that utilizes vertical stacking and multiple layers to mount electronic components. This transitions from conventional two-dimensional planar mounting to three-dimensional spatial utilization, enabling enhanced functionality without proportionally increasing the apparatus footprint. The circuit board extends in multiple directions (upward, downward, lateral) to accommodate additional components while maintaining a compact overall form factor.
Solution Approach 2:
The patent implements nesting by placing electronic components within recessed portions of the three-dimensional circuit board. These recessed areas create nested mounting spaces where components can be housed within the board structure itself rather than requiring external space. This nesting approach allows multiple components to be integrated within the boundaries of the circuit board, reducing overall apparatus size while maintaining functionality.
2Adaptability or versatility
If the mounting area for electronic components is expanded, then the functionality is enhanced, but the diameter of the endoscope increases
Solution Approach 1:
The patent resolves the diameter constraint by transitioning from planar two-dimensional mounting to three-dimensional spatial utilization. The circuit board is configured with multiple layers and vertical stacking, allowing components to be mounted in the vertical dimension and on multiple surfaces (top, bottom, sides) of the board. This three-dimensional approach increases the effective mounting area without increasing the horizontal footprint or diameter of the endoscope.
Solution Approach 2:
The patent employs recessed portions within the three-dimensional circuit board structure to house electronic components. These recessed areas create nested mounting spaces that utilize the vertical and radial space within the existing diameter constraints. By nesting components within the board's own structure rather than requiring external mounting space, the design enhances functionality while maintaining a compact diameter suitable for endoscopic applications.
3Volume of moving object
If highly-dense mounting of components is implemented, then the downsizing is achieved, but the manufacturing precision requirements increase
Solution Approach 1:
The patent applies segmentation by dividing the three-dimensional circuit board into multiple distinct mounting regions and layers. Different sections of the board are designated for specific component types, with dedicated mounting areas and connection zones. This segmentation allows for organized placement of components, reducing the complexity of high-density mounting and facilitating more manageable manufacturing processes while still achieving compact overall dimensions.
Solution Approach 2:
The patent mitigates the precision challenges of high-density mounting by utilizing three-dimensional spatial distribution. Instead of concentrating all components in a single planar area requiring extreme precision, the design distributes components across multiple layers and vertical positions. This three-dimensional arrangement provides greater tolerance for manufacturing variations in individual component positions while maintaining compact size and functional integration.
Data Source
AI summary
An image pickup unit includes: an image pickup device; a flat circuit board; a three-dimensional circuit board; plural electronic components; and plural cables, in which the three-dimensional circuit board includes: a first surface; a second surface; a third surface; a fourth surface; a fifth surface; and a sixth surface, in which on one of the first surface to the sixth surface, a recessed portion is formed and a connection terminal portion is formed in an inner surface of the recessed portion, one of the plural electronic components or the plural cables is mounted on or connected to the connection terminal portion, the recessed portion is formed, in a site where the first surface and the sixth surface cross each other, from the second surface toward the third surface, the recessed portion having a wall surface parallel to the second surface, and one of the electronic components is mounted.