3D Rigid Printed Circuits TRIZ Cases
- Sacrificial Carrier Bending for Microelectronic Package Recesses
Pre-formed corrugated sacrificial carriers create precise recesses, avoiding complex molds and reducing manufacturing costs.
- Helix Substrate 3D Package for High I/O Density
Helix substrate stairs stack IC dies along a spiral path, resolving the trade-off between high I/O density and manufacturing complexity in 3D packages.
- Light Sensor Placement Below Display Panel for Proximity Sensing
A light receiving module positioned beneath a display panel captures reflected optical signals for proximity detection.
- PCB Base Plate for Mass Spectrometer Ion Optics
A PCB base plate integrates signal-processing electronics and ion optic mounting to reduce electromagnetic noise.
- Thermoplastic Resin Composition for Laser Direct Structuring
A thermoplastic resin composition with an olefin copolymer enables precise laser direct structuring.
- MID Circuit Carrier with Conductive Adhesive PCB Integration
Conductive adhesive bonds MID carriers to PCBs, eliminating complex wire bonding and soldering steps while enabling high-density 3D circuit layouts.
- In-Mold Electronics Structure with Plated Circuit and Light Guides
Plating forms conductive circuits directly on plastic resin layers within a single film, resolving manufacturing complexity while guiding LED light emission.
- Motor Vehicle Door Lock Strip Conductor Segmentation
Segmented strip conductor sub-structures enable flexible motor vehicle door lock assembly.
- LED Interconnect Assembly with Resilient Contacts
Resilient contacts in a molded interconnect device mechanically engage LED leads, eliminating costly soldering and printed circuit boards.
- Vehicular Sensor Cooling via Thermal Conduction Element
A metallic thermal element conducts heat from a sensor circuit board to a rear housing portion for efficient dissipation.
- Metal PCB Bending Grooves for LED Integration and Heat Dissipation
Bending grooves on a metal PCB base incline chip mounting portions, improving heat dissipation while simplifying assembly complexity.
- Electronic Device Package Shielding via Trench Conductive Layer
A conductive layer extends into a board trench to form a partial shield for an electronic device package.
- 3D Multilayer Interconnect Device with Embedded PCB
Embedding a multilayer PCB inside a 3D mold resolves the trade-off between interior volume and layer count, enabling high bandwidth for radar applications.
- 3D IC Integration with Preformed Metal Routing and Through Vias
Through vias in the package substrate couple die pads to preformed metal routing layers, resolving interconnect complexity in compact mobile devices.
- Multi-Layer Wiring Substrate Cavity Design for Routing Flexibility
A metal plate supports multi-layer wiring formation inside a cavity, preventing resin damage during bending.