Metal PCB Bending Grooves for LED Integration and Heat Dissipation
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Solution Overview
Problem
Conventional metal PCB assemblies for vehicle lamps face challenges in achieving desired LED chip integration, heat dissipation, and assembly efficiency, with difficulties in mounting LED chips at a desired degree of integration and limited heat-dissipation efficiency due to separate heat sinks and complex assembly processes.
Innovation Solution
A metal PCB with a base formed of a thin metal plate, featuring bending grooves for bending and chip mounting parts with integrated LED chips, combined with a heat-dissipation plate and flexible board, allows for easy heat transfer and flexible mounting, enabling accurate angle control and simplified assembly with a stack structure and various coupling methods.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional metal PCB assembly with bent unit patterns is used, then the structure can be formed with cut faces, but the LED chip integration degree is limited and assembly complexity increases
Solution Approach 1:
The metal PCB is divided into a base and multiple independent mounting parts that are separately formed and then integrated. Each mounting part can be independently positioned and angled, allowing high-degree LED chip integration without complex overall structure. The cut faces separate the mounting parts from the base, enabling independent fabrication and assembly.
Solution Approach 2:
The mounting parts are pre-formed with specific angles and positions relative to the base using cut faces before final assembly. LED chips are mounted on these pre-positioned mounting parts, which are then integrated onto the base. This preliminary formation of mounting parts simplifies the overall assembly process while achieving high integration density.
2Temperature
If separate heat sinks are used in conventional LED lamp modules, then heat dissipation can be achieved, but the assembly process becomes complex and heat dissipation efficiency is limited
Solution Approach 1:
The heat dissipation function is merged into the base structure itself. The base is formed with a heat dissipation plate that directly contacts the mounting parts, eliminating the need for separate heat sink components. This integration simplifies the assembly process while improving heat dissipation efficiency through direct thermal conduction paths from LED chips through mounting parts to the base.
Solution Approach 2:
The base serves multiple functions simultaneously: it provides structural support, electrical connection through the metal PCB, and heat dissipation through the integrated heat dissipation plate. This multi-functionality eliminates the need for separate dedicated heat sink components, reducing assembly complexity while maintaining effective heat dissipation.
3Temperature
If conventional PCB materials are used, then standard manufacturing processes can be applied, but heat dissipation capability is insufficient
Solution Approach 1:
The base is constructed as a composite structure combining a metal material (aluminum or copper alloy) for heat dissipation with a PCB structure for electrical functionality. The metal PCB integrates the heat dissipation plate with circuit traces, combining the thermal conductivity of metal with the electrical connectivity of PCB technology. This composite approach maintains ease of manufacture through standard metal forming and PCB fabrication processes while achieving superior heat dissipation capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances LED chip integration, facilitates various illumination forms, improves heat dissipation, and simplifies the assembly process by allowing rapid coupling and accurate angle control, minimizing errors and enabling easy detachment of the metal PCB in the headlight module.
Implementation Method 1
a base 501 of a metal material... capable of being mechanically formed, such as curving or pressing... a heat sink for externally discharging heat generated by the LED
Data Source
AI summary
Provided are a metal PCB, a headlight module having the metal PCB applied thereto, and a method for assembling the headlight module, wherein the metal PCB has a base made of a metal material and configured as a thin plate, or the base has a predetermined thickness and is bent in a desired direction through a bending groove formed on the rear surface thereof, and the base has a plurality of chip mounting portions integrated thereon such that one or more LED chips are mounted thereon, the chip mounting portions being spaced at a predetermined interval and having at least two parts of incision surfaces formed on one side of the base such that the chip mounting portions are inclined and installed to have a predetermined angle with regard to the base.