Electronic Device Package Shielding via Trench Conductive Layer
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Solution Overview
Problem
The integration of multiple components into a single electronic device package in the electronic industry leads to electromagnetic interference (EMI) and poor electromagnetic compatibility (EMC) issues, necessitating the development of a component with a partial shield to prevent such interference.
Innovation Solution
An electronic device package is designed with a molded portion, a conductive layer, and a trench on the board, where the conductive layer extends into the trench to form a shield layer, preventing EMI by ensuring the conductive layer is disconnected from the masking film during deposition, thereby preventing lifting and ensuring effective shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multiple components are integrated into a single electronic device package, then device size and weight are reduced, but electromagnetic interference and poor electromagnetic compatibility occur
Solution Approach 1:
The board is divided into a shield layer formation region and a shield layer non-formation region, creating distinct zones for different functional requirements. This segmentation allows selective application of shielding in specific areas where EMI is problematic while maintaining component integration benefits in other regions.
Solution Approach 2:
A trench is formed adjacent to the molded portion border, creating a localized structural feature with specific dimensions (width larger than depth). This local modification provides targeted EMI shielding exactly where needed near the molded portion without requiring complete shielding of the entire device package.
Solution Approach 3:
A conductive layer is disposed on the molded portion surface and extends into the trench, serving as an intermediary shielding structure. This conductive layer acts as a mediator between the molded portion and surrounding components, blocking electromagnetic interference while allowing the integrated package structure to remain compact.
2Object-affected harmful factors
If a conductive layer is formed to provide shielding, then electromagnetic compatibility is improved, but lifting issues occur during manufacturing if not properly disconnected from masking film
Solution Approach 1:
The trench is formed in advance before the conductive layer deposition process. This preliminary action creates a pre-defined structural feature that guides the conductive layer formation, ensuring proper disconnection from the masking film edge and preventing lifting issues during manufacturing.
Solution Approach 2:
The trench dimensions are specifically designed with width larger than depth, creating a geometric configuration that utilizes the masking film edge as a natural stopping point for conductive layer deposition. This geometric design ensures the conductive layer is properly disconnected without requiring additional complex control mechanisms.
Data Source
AI summary
An electronic device package is disclosed. The electronic device package includes a board on which an electronic device is mounted, a molded portion formed to cover the electronic device on the board, and a conductive layer disposed on a surface of the molded portion and extended in a trench formed on the board.