MID Circuit Carrier with Conductive Adhesive PCB Integration
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Solution Overview
Problem
Existing technologies face challenges in combining injection-molded circuit carriers (MID) and printed circuit boards (PCB) effectively, limiting the creation of three-dimensional circuit structures with high interconnection and component density due to differences in manufacturing processes and properties, and lack simple, cost-effective connection mechanisms.
Innovation Solution
A direct electrical connection method using conductive adhesive connecting elements between MID and PCB, eliminating the need for external mechanical connections and sequential processes like wire bonding or soldering, allowing for high-density connections and optimal layout utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If injection-molded circuit carriers (MID) are used to create three-dimensional circuit structures, then manufacturing complexity and connection density are improved, but the ability to achieve high interconnection density and component density is limited due to manufacturing process constraints
Solution Approach 1:
The patent combines MID technology with PCB technology by integrating a printed circuit board into the injection-molded circuit carrier. The PCB is embedded within the MID structure, allowing the system to achieve three-dimensional circuit arrangements while maintaining simple manufacturing processes. This merging enables both technologies to complement each other's strengths.
Solution Approach 2:
The invention transitions from purely two-dimensional PCB connections to three-dimensional circuit arrangements by vertically integrating the PCB within the MID structure. This dimensional change allows connections in multiple directions and layers, achieving high interconnection density without increasing manufacturing complexity.
2Reliability
If additional mechanical plug-in connections are used to connect MID and PCB, then connection reliability is improved, but device volume and manufacturing complexity increase
Solution Approach 1:
The patent merges the mechanical connection function with the electrical connection function by using conductive adhesive to simultaneously provide both structural support and electrical conductivity. This eliminates the need for separate mechanical plug-in connections, reducing device volume while maintaining connection reliability.
Solution Approach 2:
The conductive adhesive serves multiple functions: it provides mechanical bonding between the MID and PCB, establishes electrical connections between contact elements, and fills gaps between components. This multi-functionality eliminates the need for additional dedicated mechanical connection elements.
3Reliability
If wire bonding or soldering processes are used to connect MID and PCB, then electrical connection quality is improved, but manufacturing complexity and production time increase
Solution Approach 1:
The patent replaces complex mechanical and thermal connection processes (wire bonding, soldering) with a simpler adhesive bonding process using conductive adhesive. This substitution maintains electrical connection quality while dramatically simplifying the manufacturing process and improving productivity.
Solution Approach 2:
The invention changes the connection method from high-temperature thermal processes (soldering) to a lower-temperature adhesive bonding process. This parameter change allows for simpler manufacturing equipment, faster production cycles, and reduced thermal stress on components while maintaining reliable electrical connections.
4Adaptability or versatility
If separate MID and PCB technologies are used independently, then each technology's advantages are maintained, but the ability to achieve high component density and connection density is limited
Solution Approach 1:
The patent merges MID and PCB technologies into a hybrid structure where the PCB is integrated within the MID carrier. This combination allows the system to achieve high component density and connection density by utilizing both the three-dimensional capabilities of MID and the high-density routing capabilities of PCB technology.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the creation of three-dimensional circuit arrangements with high interconnection and component density, combining the advantages of both MID and PCB technologies in a simple and cost-effective manner, while maintaining mechanical stability and low contact resistance.
Implementation Method 1
The electrical connection between the contact elements is provided by an electrically conductive connecting element
Data Source
Figure 1~2
AI summary
An electric circuit configuration having an MID circuit carrier and a connecting interface, the connecting interface being situated on a surface of the MID circuit carrier. The electric circuit configuration further includes at least one electrical contact pair having at least one connecting interface contact element and at least one MID contact element that is provided on the surface and is situated on the connecting interface contact element. The exemplary embodiments and/or exemplary methods of the present invention further relates to a contact element group having at least one electrical contact element for the electrical contacting of an MID circuit carrier, which is developed on a surface of an MID circuit carrier, is electrically connected to it, and extends away from the surface. The at least one contact element is connected to a line element of the MID circuit carrier.